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Flexible circuit board with improved bonding position accuracy

A flexible circuit board, joint position technology, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problem that SMT cannot be carried out smoothly

Active Publication Date: 2019-08-02
GIGALANE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, if the flexible circuit board 10 is not well installed on the printed circuit board 20, there will be a problem that SMT cannot be carried out smoothly.

Method used

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  • Flexible circuit board with improved bonding position accuracy
  • Flexible circuit board with improved bonding position accuracy
  • Flexible circuit board with improved bonding position accuracy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The first embodiment is to solve the problem that SMT cannot be carried out smoothly when the flexible circuit board 10 is not properly installed on the printed circuit board 20 . Such as Figure 2 to Figure 3 As shown, the flexible circuit board of the present invention includes a first ground 100 , a second ground 200 , a signal line 300 , a dielectric 400 , a covering layer 500 , and a position alignment part 550 .

[0032] The signal line 300 is located between the first ground 100 and the second ground 200 .

[0033] The dielectric 400 is located between the first ground 100 and the signal line 300 , and between the second ground 200 and the signal line 300 . That is, the dielectric 400 is located between the first ground 100 and the second ground 200 , and is located at least above and below the periphery of the signal line 300 .

[0034] As an example, the dielectric 400 is located on the periphery of the signal line 300 .

[0035] As another example, the diel...

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PUM

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Abstract

The present invention relates to a flexible circuit board which comprises: a signal line positioned between a first ground and a second ground; a dielectric positioned between the first ground and thesignal line and positioned between the second ground and the signal line; a cover layer positioned in a lower part of the first ground and having openings formed at regular intervals to expose the first ground; and a position alignment unit formed by crossing the opening to divide an area of the opening in half.

Description

technical field [0001] The invention relates to a flexible circuit board. Background technique [0002] Recently, coaxial cables used for high-frequency signal transmission as components of wireless terminal devices such as smartphones and tablet PCs are gradually being replaced by flexible circuit boards. [0003] In addition, SMT (Surface Mounter Technology: Surface Mount Technology) is used as a method for bonding a flexible circuit board to a printed circuit board. [0004] Such as figure 1 As shown, this SMT is to install the flexible circuit board 10 above the printed circuit board 20, the flexible circuit board ground pad 11 formed under the flexible circuit board 10 and the printed circuit board ground pad formed above the printed circuit board 20 21 are combined by solder 22 (Solder). At this time, the bonding is completed by melting the solder 22 (Solder) with heat. [0005] However, if the flexible circuit board 10 is not properly installed on the printed circ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/111H05K1/118H05K3/363H05K2201/09663H05K2203/048H05K2201/09618H05K1/0221H05K1/0266H05K3/28H05K1/028
Inventor 金相弼赵炳勋金炳悦郑熙锡
Owner GIGALANE CO LTD