Buffer structure

Abstract

The invention provides a buffer structure, which is mainly composed of an upper shell portion, a lower shell portion, at least one buffer ring portion and a buffer air chamber, wherein the buffer ring portion is elastically pressed against the upper shell portion and the lower shell portion, a deformation section of the buffer ring portion is extruded by an external force and deformed, and the deformation resistance generated when an upper guide section and a lower guide section are close to each other effectively shares the collision force born by a wafer box so as to achieve the effect of buffer and protection.

Description

technical field [0001] The present invention relates to a buffer structure, in particular to a buffer structure applied to a wafer box. Background technique [0002] In the fab, the wafer box plays a very important role. It is used to store at least two wafers and transport them between semiconductor processes. At the same time, it provides a high-clean environment for the wafers to ensure the manufacturing process. The wafers in it are free from particulate contamination from the external environment. Since the wafer itself is extremely thin, great care must be taken during handling to avoid damage to the wafer due to collisions. [0003] refer to figure 1 As shown, most of the wafer cassettes 100 in the prior art are locked at the bottom of the wafer cassette 100 with at least two buffers 10 to reduce the probability of collision of the wafer cassette 100, but the buffers 10 in the prior art only There is a shell part 11, so the anti-vibration effect provided is quite l...

AI Technical Summary

Problems solved by technology

[0003] refer to figure 1 As shown, most of the wafer cassettes 100 in the prior art are locked at the bottom of the wafer cassette 100 with at least two buffers 10 to reduce the probability of collision of the wafer cassette 100, but the buffers 10 in the prior art only There is a shell part 11, so the anti-vibration effect provided is quite limited, so that when the wafer box 100 is transported, the vibration caused by the wafer box 100 will damage the wafer box 100 or cause the particles of the wafer box 100 to fall to the wafer surface and cause The problem of the drop in wafer yield cannot fully achieve the effect of protecting the wafer; in addition, during the process of transporting the wafer box 100, due to the ups and downs on the movement path, the wafer box 100 may be tilted, etc., and in this case It may cause the wafers being transported to collide, which is prone to damage the wafers, resulting in wafer fragments, etc.

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