Preparation method and testing method of multilayer flexible electronic thin film device

An electronic film and device technology, applied in the field of preparation of multilayer flexible electronic film devices, can solve problems such as inability to simulate signal processing, and achieve the effects of being easy to fit, improving accuracy, and simplifying complexity.

Active Publication Date: 2020-03-03
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In related technologies, the flexible electronic sensor only has a signal sensor part and cannot directly process analog signals, and an additional signal processing part is required to realize signal processing

Method used

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  • Preparation method and testing method of multilayer flexible electronic thin film device
  • Preparation method and testing method of multilayer flexible electronic thin film device
  • Preparation method and testing method of multilayer flexible electronic thin film device

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Embodiment Construction

[0064] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures indicate functionally identical or similar elements. While various aspects of the embodiments are shown in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

[0065] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior or better than other embodiments.

[0066] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific implementation manners. It will be understood by those skilled in the art that the present disclosure may be practiced without some of the specific details. In some instances, methods, means, componen...

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Abstract

The disclosure relates to a method for preparing and testing a multilayer flexible electronic thin film device, comprising: depositing a first metal layer on a substrate layer; performing first photolithography and etching on the first metal layer to obtain a first electrode; Coating a photosensitive layer on the first electrode; performing photolithography and etching treatment on the photosensitive layer to open a first connection hole in the photosensitive layer to form a photosensitive layer after the hole is opened; depositing the second photosensitive layer on the photosensitive layer after the hole is opened Two metal layers; second photolithography and etching treatment are performed on the second metal layer to obtain the first strain sensor and the second electrode; wherein, the second electrode is facing the first electrode, the second electrode, the first electrode and the second electrode The photosensitive layer between the electrode and the first electrode forms a pressure sensor; the first electrode is electrically connected to the first strain sensor through the first wiring hole; the substrate layer, the first strain sensor, the photosensitive layer, the first electrode, and the second electrode Made of flexible material. The embodiments of the present disclosure can realize the integration of sensing and signal processing.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, in particular to a method for preparing and testing a multilayer flexible electronic thin film device. Background technique [0002] Flexible electronic devices are the same as traditional electronic circuit devices based on hard printed circuit boards, with sensor parts, signal processing parts, etc. The original signal collected by the sensor designed and prepared based on flexible electronic technology is generally an analog signal. Before the analog signal is transmitted, the analog signal needs to be filtered and amplified by the signal processing part. In related technologies, the flexible electronic sensor only has a signal sensor part and cannot directly process analog signals, and an additional signal processing part is required to realize signal processing. Contents of the invention [0003] In view of this, the present disclosure proposes a method for preparing and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/14G01L9/00H01L21/66H01L27/01H01L49/02
CPCG01L1/148G01L9/0073H01L27/016H01L22/34H10N97/00
Inventor 冯雪刘鑫陈毅豪
Owner TSINGHUA UNIV
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