Flexible device, manufacturing method thereof and flexible device

Abstract

The embodiment of the invention provides a flexible device, a manufacturing method thereof and a flexible device, and relates to the field of flexible devices. The manufacturing method of the flexibledevice comprises the steps that a photosensitive film is formed on a hard substrate by using photosensitive resin containing an azide compound; a substrate containing an inorganic material is formedon the photosensitive film; an electronic device functional layer is formed on the substrate; an encapsulation layer is formed on the electronic device functional layer; the photosensitive film is illuminated from the back of the substrate; the azide compound in the photosensitive film releases gas to cause a gap between the photosensitive film and the substrate; and the substrate and the electronic device functional layer and the encapsulation layer, which are carried on the substrate, are entirely peeled off from the photosensitive film.

Description

technical field [0001] The invention relates to the field of flexible devices, in particular to a flexible device, a manufacturing method thereof, and a flexible device. Background technique [0002] In recent years, flexible electronic products have attracted worldwide attention and developed rapidly. During the manufacturing process of at least some flexible devices in flexible electronic products, a PI film (polyimide film) is often formed on a hard glass substrate, and related electronic devices are made on the PI film, and the related electronic devices After the fabrication is completed, the glass substrate is separated from the PI film to form a flexible device with the PI film as the substrate. [0003] For the above-mentioned flexible devices using PI film as the substrate, on the one hand, the PI film needs to adopt a high-temperature curing process during the formation process, so the supporting glass substrate used must be high-temperature glass, resulting in an...

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Problems solved by technology

[0003] For the above-mentioned flexible devices using PI film as the substrate, on the one hand, the PI film needs to adopt a high-temperature curing process during the formation process, so the supporting glass substrate used must be high-temperature glass, resulting in an increase in cost; on the other hand, Since the PI film itself is used as the supporting substrate of the flexible device, its own thickness is relatively large, and the stress of the PI film itself is relatively large, so the glass substrate is prone to breakage (that is, fragments).

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