Impregnation device and method for preparing copper-clad laminated board

Abstract

The invention discloses an impregnation device and method for preparing a copper-clad laminated board. The impregnation device comprises a water-soluble resin impregnation tank, a hydrophobic resin impregnation tank, a tension mechanism, a drum, a winding structure and a glass fiber fabric, and the glass fiber fabric penetrates through the water-soluble resin impregnation tank, the tension mechanism, the winding mechanism, the drum and the hydrophobic resin impregnation tank in sequence. The impregnation method for preparing the copper-clad laminated board comprises the following steps that firstly, the glass fiber fabric is subjected to primary impregnation in the water-soluble resin impregnation tank through a first roller set; secondly, a first motor and a second motor are controlled bya controller to adjust a winding frame and a tension frame; thirdly, the glass fiber fabric is imported into the hydrophobic resin impregnation tank through the drum to conduct secondary impregnation, and impregnation is finished. The device can effectively prevent the glass fiber fabric from being deviated; by means of the method, the interior of the glass fiber fabric is thoroughly impregnated,and the later hydrophobic resin impregnation effect is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board preparation, in particular to an impregnation device and impregnation method for preparing copper-clad laminates. Background technique [0002] The PCB board is also a printed circuit board, also known as a printed circuit board or a printed circuit board. It is an important electronic component and a carrier for the electrical connection of electronic components. [0003] Copper-clad laminates (referred to as copper-clad laminates) are substrate materials for making printed circuit boards. Copper-clad laminates are made into required printed circuit boards after etching, electroplating, and lamination of multi-layer boards. According to the number of layers of copper foil, it can be divided into single-layer printed circuit boards, double-layer printed circuit boards and multi-layer printed circuit boards. [0004] Because of this importance of printed circuit boards, copper clad l...

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Problems solved by technology

[0005] The prior art device contains only one impregnation tank, so the paper base can only be impregnated once with a single resin

Because the impregnation of glass fiber cloth with water-soluble resin will cause the glass fiber cloth to become hard and brittle after drying, which is not suitable for the stamping process in the subsequent steps, so the glass fiber cloth can only be impregnated with hydrophobic resin. The resin has poor permeability. When the glass fiber cloth is immersed in it for impregnation, the inside of the glass fiber cloth cannot be completely impregnated, thus reducing the electrical insulation of the copper clad laminate; when the glass fiber cloth is wound between two impregnation tanks, when the roll When the take-up amount is large, there will be a phenomenon of coiling irregularity. When the coiling is incorrect, the coiled glass fiber cloth will be biased to one side. In order not to coil incorrectly, the length of the glass fiber cloth impregnated each time is limited. Seriously affect production efficiency

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