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Gluing mechanism based on copper-clad plate process

A technology of copper clad laminate and process, applied in the field of gluing mechanism based on copper clad laminate process, can solve problems such as precipitation and affect the quality of glue, and achieve the effect of high quality glue

Active Publication Date: 2020-01-07
安徽鸿海新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the glue is in the glue tank, on the one hand, it needs to maintain a constant temperature state; on the other hand, the substance of the glue may precipitate under the action of gravity, thus affecting the quality of the glue.

Method used

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  • Gluing mechanism based on copper-clad plate process
  • Gluing mechanism based on copper-clad plate process
  • Gluing mechanism based on copper-clad plate process

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Embodiment Construction

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings, in which several embodiments of the present invention are shown, but the present invention can be realized in different forms, and is not limited to the text described On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0030] It should be noted that when an element is said to be "fixed on" another element, it can be directly on the other element or there can be an intervening element, and when an element is said to be "connected" to another element, it can be Directly connected to another element or possibly intervening elements at the same time, the terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

[0031] Unless otherwise defined, all technical and scien...

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PUM

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Abstract

The invention discloses a gluing mechanism based on a copper-clad plate process. The gluing mechanism comprise a glue barrel, a first stirring structure is arranged in the glue barrel, and is in sliding connection to the inner wall of the glue barrel, a constant-temperature cavity is arranged below the glue barrel, a first guide pipe is arranged below the constant-temperature cavity, a first electromagnetic valve is arranged on the first guide pipe, the first guide pipe is detachably connected with a glue groove, a moving type stirring mechanism is arranged in the glue groove, and a constant temperature device is arranged on the inner side of the glue groove; and a reinforced base material supply mechanism is arranged above the glue groove, and a blowing device is correspondingly arrangedabove the reinforced base material supply mechanism.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminate processing, and mainly relates to a gluing mechanism based on the copper-clad laminate process. Background technique [0002] Copper clad laminate --- also known as substrate. The reinforcing material is impregnated with resin, one or both sides are covered with copper foil, and a plate-shaped material is formed by hot pressing, which is called copper-clad laminate. It is the basic material for PCB, often called substrate. When it is used in multilayer board production, it is also called core board (CORE). [0003] Existing copper clad laminates use a heating mechanism to heat the glue solution in the glue tank when the glue is adjusted, and then transfer the glue through the reinforced substrate supply mechanism. [0004] However, in the glue tank, on the one hand, the glue needs to be kept at a constant temperature, and on the other hand, the substance of the glue may precipitate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/11B05C11/10B05C13/02B01F13/10B01F7/18B01F7/24
CPCB05C11/11B05C11/1042B05C13/02B01F27/2322B01F27/808B01F27/85B01F27/92B01F27/90B01F33/821
Inventor 苏晓渭刘强李勇军
Owner 安徽鸿海新材料股份有限公司