An integrated equipment for copper foil gluing, drying and cutting

Abstract

The invention relates to the field of copper foil processing, in particular to a gluing, drying and cutting integrated device for a copper foil. The device comprises a copper foil feeding device, a wrinkle removing mechanism, a gluing mechanism, a drying mechanism and a cutting mechanism. The wrinkle removing mechanism comprises a wrinkle removing table and a wrinkle removing assembly. The gluingmechanism comprises a gluing table, a lifting gluing assembly and a leveling driving assembly, and the gluing table is arranged at one end of the wrinkle removing table. The end, close to the gluing table, of the wrinkle removing table is provided with a first feeding assembly. The drying assembly comprises a drying table, a drying bin and a drying assembly. The two ends of the drying bin are provided with a feed inlet and a discharge outlet correspondingly, and the feed inlet and the discharge outlet of the drying bin are provided with a second feeding assembly and a third feeding assembly correspondingly. The cutting mechanism comprises a cutting table and a cutting assembly. The cutting table is located at the end, close to the discharge outlet, of the drying bin, and the end, away fromthe drying bin, of the cutting table is provided with a discharge conveyor. The production efficiency is improved, the gluing thickness can be controlled, the copper foil can be evenly coated with glue, and subsequent processing is facilitated.

Description

Technical field [0001] The invention relates to the field of copper foil processing, in particular to an integrated device for coating, drying and cutting copper foil. Background technique [0002] Copper foil is a kind of negative electrolytic material, a thin, continuous metal foil deposited on the base layer of the circuit board, which acts as the conductor of the PCB. It easily adheres to the insulating layer, accepts the printed protective layer, and forms a circuit pattern after corrosion. Copper foil has low surface oxygen characteristics, can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. In the copper foil production process, the copper foil needs to be glued, and then The coated copper foil is dried, and then cut into a specified size to fit the aluminum substrate. Each process requires manual operation. The labor intensity of workers is high and the production efficiency is low. The existing glue coatin...

AI Technical Summary

Problems solved by technology

Copper foil has low surface oxygen characteristics, and can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. In the production process of copper foil, it is necessary to glue the copper foil, and then Copper foil after gluing is dried, and after drying, it is cut into a specified size to fit the aluminum substrate. Each process needs to be operated manually. The labor intensity of the workers is high and the production efficiency is low. The existing gluing The equipment cannot adjust the thickness of the covering glue applied on the copper foil when applying glue, and the applied glue is uneven, which is not conducive to subsequent processing. Therefore, we propose an integrated equipment for copper foil glue coating, drying and cutting, so as to facilitate solve the problems raised above

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