Processing method for solving size expansion and contraction of large spliced PCB in SMT printing
A processing method and splicing technology, which are applied in the direction of assembling printed circuits with electrical components, printed circuits, and printed circuit manufacturing.
Active Publication Date: 2020-02-18
ZHUHAI ALL WINNER FPC
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Problems solved by technology
[0005] In order to meet the above requirements, the purpose of the present invention is to provide a processing method for solving the size expansion and contraction of FPC large panels in SMT printing. The relatively fixed size of the jigsaw panel is used for large-scale jigsaw production
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0027] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of descri...
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The invention discloses a processing method for solving the size expansion and contraction of a large spliced PCB in SMT printing. The method comprises: combining two solder paste printing machines together according to a processing requirement; manufacturing a first stencil and a second stencil to produce an actual product; disposing a small window for printing on the left side of the first stencil, disposing no window on the right side of the first stencil, disposing a large window on the left side of the second stencil, and disposing a small window for printing on the right side of the second stencil; designing an induction PAD according to the left and right sections of the first and second stencils; installing the first and second stencils on the two solder paste printing machines respectively, and installing scrapers at the small windows of the first stencil and the second stencil; performing printing on the left side of a FPC substrate and on the right side of the FPC substrate;and after the detection results of the printed FPC substrate thickness and offset are normal, mounting SMT devices on the FPC substrate and performing furnace processing to output a board.
Description
technical field [0001] The invention relates to the technical field of SMT processing and manufacturing of FPC jigsaw panels, in particular to a processing method for solving the size expansion and contraction of FPC jigsaw panels during SMT printing. Background technique [0002] Generally, the size of FPC (flexible circuit board) SMT printed solder paste and pasted devices is small. The reason is that the size of FPC has a certain change during processing, and a small change in conditions during production will also affect the size. SMT steel The net can only be made within the smaller size of the panel (such as within 250mm*250mm), and the expansion and contraction value of the larger panel is difficult to control, so it is processed under the smaller panel. The above-mentioned reasons make the entire SMT processing process inefficient, resulting in the inability to increase the output. [0003] The information disclosed in this Background section is only intended to enh...
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IPC IPC(8): H05K3/34
CPCH05K3/341
Inventor 邓承文罗正武
Owner ZHUHAI ALL WINNER FPC