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A chemical passivation plastic sealing system

A technology of chemical passivation and bag sealing, applied in the field of passivation, can solve problems such as low efficiency, errors, and differences in the level of operators, and achieve the effect of reducing differences and improving efficiency

Active Publication Date: 2022-07-29
XIAN ESWIN MATERIAL TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the process of chemical passivation, since the air bubbles and excess iodine solution in the plastic bag need to be removed artificially, and then the rectangular plastic bag wrapping the silicon wafer is plastic-sealed many times and then turned into a round shape that tightly wraps the silicon wafer. In this way, there will be problems of long processing time and low efficiency, and the results of chemical passivation will be different due to different levels of operators, resulting in large errors

Method used

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  • A chemical passivation plastic sealing system
  • A chemical passivation plastic sealing system
  • A chemical passivation plastic sealing system

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Embodiment 1

[0037] See figure 1 and figure 2 , figure 1 is a schematic structural diagram of a chemical passivation plastic sealing system provided by an embodiment of the present invention, figure 2 It is a front view of a chemical passivation plastic sealing system provided by an embodiment of the present invention. The embodiment of the present invention provides a chemical passivation and plastic sealing system, and the chemical passivation and plastic sealing system can be used for passivation and plastic sealing of a sample 40 that needs passivation and plastic sealing. Passivated and plastic encapsulated materials. Specifically, the chemical passivation plastic sealing system may include a conveying positioning mechanism 10, a conveying mechanism 20 and a plastic sealing mechanism 30 which are sequentially arranged in the conveying direction, wherein,

[0038] The conveying and positioning mechanism 10 is used for positioning the sample 40 in the plastic bag and transferring ...

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Abstract

The invention discloses a chemical passivation plastic sealing system, comprising a conveying positioning mechanism, a conveying mechanism and a plastic sealing mechanism arranged in sequence in the conveying direction, wherein the conveying positioning mechanism is used for positioning the samples in the plastic sealing bags and placing the The sample in the plastic bag is sent to the conveying mechanism; the conveying mechanism is used for removing air bubbles in the plastic bag loaded with the sample, and transferring the sample in the plastic bag to the plastic sealing mechanism On; the plastic sealing mechanism is used for plastic sealing of the samples in the plastic sealing bag. The whole process of the chemical passivation plastic sealing system provided by the present invention not only does not need to manually remove the air bubbles in the plastic sealing bag, but also can accurately plastic sealing the plastic sealing bag according to the sample size, and can complete the plastic sealing of the sample at one time, which improves the chemical efficiency. The efficiency of passivation reduces the difference between passivation effects due to operator level issues.

Description

technical field [0001] The invention belongs to the technical field of passivation, and in particular relates to a chemical passivation plastic sealing system. Background technique [0002] With the increasing integration of integrated circuits, the quality requirements for the required single crystal silicon wafers are also getting higher and higher. People often use non-equilibrium minority carrier lifetime (minority carrier lifetime) to reflect the quality of silicon wafers. good or bad. The minority carrier lifetime of a silicon wafer refers to the average time for the recombination of minority carriers of excited hole-electron pairs under the excitation of energy (1.12 eV) greater than the semiconductor band gap. Metals and defects will become effective recombination centers. When there are more metals and defects in the silicon wafer, the minority carrier lifetime will be greatly reduced, so the length of the minority carrier lifetime can reflect the quality of the si...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/68H01L21/56
CPCH01L21/56H01L21/68H01L21/67742H01L21/6776
Inventor 张翔
Owner XIAN ESWIN MATERIAL TECH CO LTD