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A system for chemical passivation

A chemical passivation and sample technology, applied in the field of passivation, can solve the problems of difference in operator level, low efficiency, long processing time, etc., to reduce the difference between passivation effects and improve the effect and efficiency.

Active Publication Date: 2022-05-24
XIAN ESWIN MATERIAL TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the process of chemical passivation, since the air bubbles and excess iodine solution in the plastic bag need to be removed artificially, and then the rectangular plastic bag wrapping the silicon wafer is plastic-sealed many times and then turned into a round shape that tightly wraps the silicon wafer. In this way, there will be problems of long processing time and low efficiency, and the results of chemical passivation will be different due to different levels of operators, resulting in large errors

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  • A system for chemical passivation
  • A system for chemical passivation

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Embodiment 1

[0029] See figure 1 and figure 2 , figure 1 is a schematic structural diagram of a system for chemical passivation provided by an embodiment of the present invention, figure 2 It is a schematic structural diagram of another system for chemical passivation provided by the embodiment of the present invention. An embodiment of the present invention provides a system for chemical passivation. The system for chemical passivation includes: a rotatable bubble removing device 10, a rotatable sample stage 20, a sealing mechanism 30 that can move up and down, The removal device 10 is located above the sample stage 20, the sealing mechanism 30 is located above the bubble removal device 10, and the bubble removal device 10 and the sample placement area 201 of the sample stage 20 are arranged opposite to each other, and the sealing part 301 of the sealing mechanism 30 and the sample The sealing area 202 of the carrier 20 is arranged opposite, wherein,

[0030] The sample stage 20 is ...

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Abstract

The invention discloses a system for chemical passivation, which includes a bubble removal device, a sample carrier, and a sealing mechanism. The bubble removal device is located above the sample carrier, and the sealing mechanism is located above the bubble removal device. The bubble removal device and the sample The sample placement area of ​​the carrier is set oppositely, the sealing part of the sealing mechanism is set opposite to the sealing area of ​​the sample carrier, the sample carrier is used to place the sample to be sealed in the sample placement area; the bubble removal device is used to make the passivation liquid uniform Spread it on the sample to be sealed to remove the air bubbles and excess passivation liquid in the sealing film loaded with the sample to be sealed; the sealing mechanism is used to seal the sealing film in the sealing area. The system for chemical passivation of the present invention does not need to artificially remove air bubbles in the sealing film, and can accurately plastic seal the sealing film, which improves the effect and efficiency of chemical passivation, and reduces the passivation caused by the level of operators difference between effects.

Description

technical field [0001] The invention belongs to the technical field of passivation, in particular to a system for chemical passivation. Background technique [0002] With the increasing integration of integrated circuits, the quality requirements for the required single crystal silicon wafers are also getting higher and higher. People often use non-equilibrium minority carrier lifetime (minority carrier lifetime) to reflect the quality of silicon wafers. good or bad. The minority carrier lifetime of a silicon wafer refers to the average time for the recombination of minority carriers of excited hole-electron pairs under the excitation of energy (1.12 eV) greater than the semiconductor band gap. Metals and defects will become effective recombination centers. When there are more metals and defects in the silicon wafer, the minority carrier lifetime will be greatly reduced, so the length of the minority carrier lifetime can reflect the quality of the silicon wafer. [0003] A...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67005H01L21/67126
Inventor 张翔蒲以松
Owner XIAN ESWIN MATERIAL TECH CO LTD