The invention discloses a packaging process for
white light-emitting diodes (LEDs). The packaging process comprises the following steps of blending
silica gel A,
silica gel B, a brightening agent, an anti-
settling agent,
aluminate phosphor and
nitride phosphor according to a
mass proportion of 0.4:1.6:0.01:0.01:0.73:0.08 to prepare fluorescent gel, wherein the
model number of the
silica gel A is 1520A, and the
model number of the silica gel B is 1520B; dispensing the prepared fluorescent gel into blue LED chips to be packaged, placing the blue LED chips to be packaged on the inner wall of a revolving drum of a centrifugal
machine in batches, and revolving the revolving drum for 160 to 200 seconds at revolving speed of 1,800 to 2,200
revolutions per minute; and placing the centrifugally precipitated LEDs into an oven, baking the LEDs for 50 to 70 minutes at 70 to 90 DEG C, and baking the LEDs for 110 to 130 minutes at 140 to 160 DEG C. The emission wavelengths of the LED chips are matched with the
excitation wavelength of the
phosphor, so that an optimal color rendering property is achieved; a
refractive index after the silica gel A and the silica gel B are blended can reach 1.53, so that the luminous efficiency can be improved, and
radiation can be improved; a centrifugal
precipitation mode is adopted, the fluorescent gel can be precipitated at the bottom of an LED support, and residual light on the lateral surfaces of the chips can be totally reflected, so that the luminous efficiency can be improved by 5 to 10 percent; and the spectroscopical BIN-based targeting rate of a centrifugal
precipitation process is greatly increased.