Chemical passivation plastic package system

Abstract

The invention discloses a chemical passivation plastic packaging system which comprises a conveying positioning mechanism, a conveying mechanism and a plastic packaging mechanism which are sequentially arranged in the conveying direction, and the conveying positioning mechanism is used for positioning a sample in a plastic packaging bag and conveying the sample in the plastic packaging bag to theconveying mechanism; the conveying mechanism is used for removing bubbles in the plastic package bag loaded with the sample and conveying the sample in the plastic package bag to the plastic package mechanism; and the plastic packaging mechanism is used for carrying out plastic packaging on the sample in the plastic packaging bag. According to the chemical passivation plastic package system provided by the invention, bubbles in the plastic package bag do not need to be manually removed in the whole process; in addition, the plastic package bag can be accurately subjected to plastic package according to the size of the sample, the plastic package of the sample can be completed at a time, the chemical passivation efficiency is improved, and the difference between the passivation effects caused by the level problem of operators is reduced.

Description

technical field [0001] The invention belongs to the technical field of passivation, and in particular relates to a chemical passivation plastic sealing system. Background technique [0002] With the increasing integration of integrated circuits, the quality requirements for the required substrate single crystal silicon wafers are also getting higher and higher. People often use non-equilibrium minority carrier lifetime (minority carrier lifetime) to reflect the quality of silicon wafers. good or bad. The minority carrier lifetime of a silicon wafer refers to the average time for the excited hole-electrons to recombine minority carriers under the excitation of energy (1.12eV) greater than the semiconductor band gap. Metals and defects will become effective recombination centers. When there are more metals and defects in the silicon wafer, the minority carrier lifetime will be greatly reduced, so the length of the minority carrier lifetime can reflect the quality of the silic...

AI Technical Summary

Problems solved by technology

[0004] However, in the process of chemical passivation, since the air bubbles and excess iodine solution in the plastic bag need to be removed artificially, and then the rectangular plastic bag wrapping the silicon wafer is plastic-sealed many times and then turned into a round shape that tightly wraps the silicon wafer. In this way, there will be problems of long processing time and low efficiency, and the results of chemical passivation will be different due to different levels of operators, resulting in large errors

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