Reflow soldering clamping and positioning device of microwave assembly

A microwave assembly and positioning device technology, which is applied to auxiliary devices, welding equipment, printed circuits, etc., can solve the problem of no reflow soldering clamping and positioning device suitable for microwave assemblies, and achieves strong applicability and versatility. The method is reliable Precise, good thermal conductivity results

Pending Publication Date: 2020-05-05
SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a microwave component reflow soldering clamping and positioning device to solve the technical problem that there is no reflow soldering clamping and positioning device suitable for the above microwave components in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Reflow soldering clamping and positioning device of microwave assembly
  • Reflow soldering clamping and positioning device of microwave assembly
  • Reflow soldering clamping and positioning device of microwave assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] A clamping and positioning device for reflow soldering of microwave components proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that the drawings are all in a very simplified form and use imprecise ratios, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0044] Meanwhile, expressions such as "first" and "second" are only used for the purpose of distinguishing multiple configurations, rather than limiting the order among configurations or other features.

[0045] In addition, an expression of "comprising" an element is an "open" expression, which merely means that there is a corresponding component, and should not be interpreted as excluding additional components.

[0046] P...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a reflow soldering clamping and positioning device of a microwave assembly. The microwave assembly comprises a shell and a circuit board, wherein the clamping and positioning device comprises a base, a plurality of positioning parts, at least two shell pressing assemblies and a circuit board pressing block assembly. Each positioning part is arranged on the base, and the positioning parts are used for positioning the relative position of the shell on the base; each shell pressing assembly is connected with the base, and the shell pressing assemblies are used for pressingthe shell on the base; and the circuit board pressing block assembly is connected with the base and used for pressing the circuit board on the shell. The reflow soldering clamping and positioning device of the microwave assembly can conveniently, quickly and accurately position and clamp the microwave assembly, and solves the technical problem in the prior art that the reflow soldering clamping and positioning device is not suitable for the microwave assembly containing the printed board or a microstrip board, the shell and electronic components.

Description

technical field [0001] The invention belongs to the technical field of clamping and positioning devices in the welding and assembling process of aerospace electronic components, and in particular relates to a clamping and positioning device for reflow soldering of microwave components. Background technique [0002] Microwave components in aerospace electronic products are the basis of active phased array antennas and the core components of active phased array radars. The consistency of welding quality of microwave components directly affects the radar’s overall performance. Active phased array radar needs to be composed of hundreds or thousands of microwave components. Microwave components include circuit boards, electronic components and housings, and circuit boards can be printed boards or microstrip boards. In order to meet the requirements of the carrier and load, aerospace electronic products have very high requirements on the assembly process. Even mass-produced prod...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K3/08B23K1/00B23K1/008B23K101/42
CPCB23K3/08B23K3/087B23K1/0016B23K1/008B23K2101/42
Inventor 陈磊柴艳红王鹏
Owner SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap