Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cleaning device

A technology for cleaning devices and mounting plates, applied in cleaning methods and utensils, cleaning methods using liquids, cleaning methods using tools, etc., can solve problems such as difficult to quickly wipe products, wiping materials deviation, etc.

Active Publication Date: 2020-06-19
KUNSHAN XUNTAO PRECISION MACHINERY
View PDF10 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the surface of the product is small, and the length and width are only about three or four millimeters, it is difficult to wipe it quickly without damaging the product, and even if it is done, the wiping material will also appear to deviate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cleaning device
  • Cleaning device
  • Cleaning device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0048] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of product cleaning and discloses a cleaning device. The cleaning device comprises an installation plate, a wiping workpiece, a disengagement prevention sleeve and an elastic pat. The wiping workpiece is arranged on the installation plate in a sliding mode, a wiping head is arranged at the first end of the wiping workpiece, and dust-free cloth is woundon the head of the wiping head. The disengagement prevention sleeve is arranged on the outer side of the wiping head in a sleeving mode, the head of the wiping head is exposed out of the disengagementprevention sleeve and butts the dust-free cloth against the surface of a product, and a gap allowing the dust-free cloth to penetrate through is formed between the inner side wall of the disengagement prevention sleeve and the outer side wall of the wiping head. The two ends of the elastic part act on the installation plate and the wiping workpiece respectively. The dust-free cloth is arranged inthe gap between the disengagement prevention sleeve and the side wall of the wiping head in a penetrating mode, and the dust-free cloth is limited by the disengagement prevention sleeve and cannot deflect or disengage from the wiping head. The elastic force of the elastic part can make the head of the wiping head butt the dust-free cloth against the surface of the product, the wiping head and thesurface of the product are in elastic contact, rigid contact to the surface of the product can be avoided, and damage to the product can be avoided.

Description

technical field [0001] The invention relates to the technical field of product cleaning, in particular to a cleaning device. Background technique [0002] In the assembly of some electronic products, it is necessary to spray and wipe alcohol on the small surface of the product to remove dirt such as residual glue on the surface. [0003] The current way of wiping is to use a cylinder to drive the dust-free cloth to wipe, and automatically replace the contaminated dust-free cloth after wiping. However, because the surface of the product is small, and the length and width are only about three or four millimeters, it is difficult to wipe it quickly without damaging the product, and even if it is done, the wiping material will also appear to deviate. [0004] Therefore, there is an urgent need for a cleaning device to solve the above technical problems. Contents of the invention [0005] The object of the present invention is to provide a cleaning device, which can not damag...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B08B1/00B08B3/02B08B3/08B08B13/00
CPCB08B3/02B08B3/08B08B13/00B08B1/143
Inventor 朱鹏举付国董
Owner KUNSHAN XUNTAO PRECISION MACHINERY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com