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Adsorption mechanism, pressing device and pressing method of display module

A technology of adsorption mechanism and pressing device, applied in the direction of identification device, electrical components, electrical components, etc., can solve problems such as excessive deviation of binding accuracy and affecting line conduction

Active Publication Date: 2021-01-05
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high interference of the driver chip 700 (the gap value is greater than or equal to 1 mm), when the COF film is actually bonded, the bonding area 501 of the COF film 500 will have a large deviation in bonding accuracy ( Generally larger than 400um) problems, affecting the conduction of the line

Method used

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  • Adsorption mechanism, pressing device and pressing method of display module
  • Adsorption mechanism, pressing device and pressing method of display module
  • Adsorption mechanism, pressing device and pressing method of display module

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Embodiment Construction

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the a...

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Abstract

The invention discloses an adsorption mechanism, a pressing device and a pressing method of a display module. The adsorption mechanism is used for pressing a chip-on-film and a display substrate, andcomprises at least one first adsorption jig and at least one second adsorption jig, wherein the first adsorption jig is configured to adsorb and adjust a binding area of the chip-on-film, and the second adsorption jig is configured to adsorb and adjust the non-binding area of the chip on film so as to eliminate the precision deviation of the binding area in the pressing process.

Description

technical field [0001] The present application relates to the technical field of fixtures for display devices, in particular to an adsorption mechanism, a pressing device and a pressing method for display modules. Background technique [0002] At present, the most ideal way for Mini / Micro LED seamless splicing is to use the back strapping method. The back-bound type is to place a plurality of thin film transistors and a plurality of LED chips on the front of a glass substrate, and the outer pin binding area is placed on the back of the glass substrate, and in the back of the glass substrate Bonding a chip-on-film (COF) avoids seams caused by bending of the chip-on-film in conventional bonding methods, wherein the glass substrate is used as a supporting structure. see figure 1 , figure 1 It is a structural schematic diagram of a display module in the prior art. Such as figure 1 As shown, the display module includes a glass substrate 100, at least one display substrate 20...

Claims

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Application Information

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IPC IPC(8): H05K13/04G09F9/33
CPCG09F9/33H05K13/04H05K13/0409
Inventor 陈皓杨荣娟
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD