Semiconductor device

A semiconductor and device technology, applied in the field of plastic grid solder ball array package structure, can solve problems such as reducing moisture resistance

Inactive Publication Date: 2003-10-15
OKI ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A specific type of encapsulating resin 7 may cause the resist 8 to release its silicon component and subsequently peel off from the encapsulating resin 7 at the interface, triggered by the sealing during mounting to the motherboard or the thermal process in the reflow process, thereby Reduced moisture resistance

Method used

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  • Semiconductor device
  • Semiconductor device
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Examples

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no. 1 example

[0037] According to the first embodiment, the copper sheet 6 attached to the sealing side of the organic substrate 1 adheres stronger to the sealing resin 7 than to the ordinary resist 8 . This prevents the peeling of the sealing resin 7 which may originate from the thermal process in the sealing or reflow process, and keeps moisture from entering, thereby minimizing a decrease in moisture resistance.

[0038] In addition, the copper sheet 6 (conductive material) is located above the signal lines of the pattern, thereby reducing the induction of signals.

[0039] A second embodiment of the present invention will now be described.

[0040] Figure 4 It is a sectional view of the P-BGA of the second embodiment along the line B-B in FIG. 5 . Fig. 5 is a plan view of the P-BGA of the second embodiment seen from the substrate sealing side.

[0041] The difference between the second embodiment and the first embodiment is that there is a window 6A for providing a connection area o...

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Abstract

A copper sheet 6 having an aperture provided therein at a bonding area for clearing the semiconductor chip 4 and its bonding wires 5 is bonded by an adhesive 3 to a sealing side of an organic substrate 1 which has been loaded on the sealing side with a pattern of copper foil wiring 2. The copper sheet 6 is higher in the adhesivity to a sealing resin 7 than any conventional resist. A resultant semiconductor device according to the present invention will prevent detachment of the sealing resin at interface which may result from a thermal history in the sealing or reflow process and eliminate entrance of water hence minimizing declination in the resistance to moisture.

Description

technical field [0001] The present invention relates to semiconductor devices, specifically to a plastic grid ball array package (hereinafter referred to as P-BGA) structure. Background technique [0002] The structure of a general P-BGA will now be explained with reference to the relevant drawings. [0003] Figure 11 is the cross-sectional view of the P-BGA, and Figure 12 yes Figure 11 Enlarged view of region A in the middle. [0004] Shown are an organic substrate 1, a copper foil wiring pattern 2, a semiconductor chip 4, bonding wires 5, sealing resin 7, resist 8, ground layer 9 and solder balls 12. [0005] The general procedure for manufacturing a P-BGA structure is to coat an organic substrate 1 made of, for example, bismaleic triazine (bismaleic triazine) resin with a copper foil wiring pattern 2 with a thickness of 10-40 μm with a resist 8 to Protect most of the wiring pattern 2 area that is not connected with the bonding wire, place the semiconductor chip 4 on...

Claims

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Application Information

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IPC IPC(8): H01L23/28H01L21/52H01L21/60H01L23/31H01L23/498
CPCH01L2224/73265H01L2924/15153H01L2924/12044H01L2224/32225H01L2924/01015H01L2224/48091H01L2924/01004H01L23/49816H01L2924/1517H01L2224/48225H01L2924/01006H01L2924/01078H01L2924/01028H01L2924/3011H01L24/48H01L2924/01079H01L2924/15311H01L2924/01014H01L2924/01005H01L2924/01082H01L2924/30107H01L2924/014H01L23/49822H01L24/49H01L2924/01029H01L2224/49109H01L2224/48227H01L23/3128H01L2924/01033H01L2924/3025H01L2924/01075H01L2924/00011H01L2924/00014H01L2924/181H01L2924/00H01L2924/00012H01L2224/45099H01L23/28
Inventor照井诚
OwnerOKI ELECTRIC IND CO LTD