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High-heat-resistance halogen-free flame-retardant polyamide compound and preparation method thereof

A flame-retardant polyamide, high heat-resistant technology, applied in the field of high heat-resistant halogen-free flame-retardant polyamide compound and its preparation, can solve the problems of precipitation, poor compatibility of dipentaerythritol and polyamide, and achieve improved compatibility performance and improve the mechanical properties

Active Publication Date: 2021-03-30
TIANJIN KINGFA NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent CN103168076 uses dipentaerythritol to improve the heat resistance of flame-retardant polyamide, and its high-temperature heat resistance is much higher than that of copper salt flame-retardant polyamide materials, but dipentaerythritol has poor compatibility with polyamide, and precipitation occurs during long-term use risks of

Method used

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  • High-heat-resistance halogen-free flame-retardant polyamide compound and preparation method thereof
  • High-heat-resistance halogen-free flame-retardant polyamide compound and preparation method thereof
  • High-heat-resistance halogen-free flame-retardant polyamide compound and preparation method thereof

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Embodiment Construction

[0035] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0036] The present invention will be described in detail below in conjunction with examples.

[0037] 1, the raw material sources used in the present invention are as follows:

[0038] PA66, grade PA66 EP-158, Huafon Group;

[0039] PA66 / 6T, grade C1504T, Shandong Guangyin Company;

[0040] PA6T / 6I, grade SELAR PA-3426NC010, DuPont;

[0041] Glass fiber, grade ECS10-3.0-568H, China Jushi Co., Ltd.;

[0042] Novolac resin-1, molecular weight is 500g / mol, Shengquan Group;

[0043] Novolac resin-2, molecular weight is 2000g / mol, Shengquan Group;

[0044] Novolac resin-3, molecular weight is 5000g / mol, Shengquan Group;

[0045] Halogen-free flame retardants:

[0046] Aluminum diethylphosphinate, grade OP1230, phosphorus content 23-24%, Klein Company;

[0047] Boehmite, grade BG-613SO, One Stone;

[0048...

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Abstract

The invention provides a high-heat-resistance halogen-free flame-retardant polyamide compound. The high-heat-resistance halogen-free flame-retardant polyamide compound is characterized by being prepared from the following raw materials, by weight: 10 to 60 parts of aliphatic polyamide, 5 to 30 parts of aromatic polyamide, 10 to 30 parts of a halogen-free flame retardant, 1 to 10 parts of phenolicresin, 10 to 50 parts of a glass fiber, and 0.1 to 0.5 part of an antioxidant; the phenolic resin is linear phenolic resin, and the molecular weight of the phenolic resin is 1000-4000 g / mol. Accordingto the high-heat-resistance halogen-free flame-retardant polyamide compound and the preparation method thereof disclosed by the invention, the halogen-free flame-retardant polyamide compound is endowed with excellent ageing resistance, flame retardance and mechanical property through the combined synergistic effect of multiple components including the phenolic resin, the antioxidant, the aromaticnylon and the halogen-free flame retardant.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high heat-resistant halogen-free flame-retardant polyamide compound and a preparation method thereof. Background technique [0002] Halogen-free flame retardant polyamide has excellent flame retardancy, mechanical properties, heat resistance, low smoke and environmental protection, and is widely used in the fields of electronics, automobiles and aerospace. At present, industries such as electronic appliances and new energy are showing the development trend of high current, thin wall, miniaturization and integration. High current, miniaturization and integration will cause the local temperature of the part to be too high, and plastic will occur Thermal oxidation leads to a sharp decrease in its mechanical properties, which in turn leads to functional failure of the part and, in severe cases, a safety accident. Therefore, this puts forward more stringent requirements o...

Claims

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Application Information

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IPC IPC(8): C08L77/06C08L77/10C08L61/06C08K13/04C08K7/14C08K5/5313C08K3/22C08K3/38C08K5/20
CPCC08L77/06C08L77/10C08L2201/08C08L2201/02C08L2201/22C08L2205/03C08K2003/2227C08K2003/387C08L61/06C08K13/04C08K7/14C08K5/5313C08K3/22C08K3/38C08K5/20
Inventor 张亚军王丰丁超郑一泉黄险波叶南飚陈平绪王中林戴剑张现军
Owner TIANJIN KINGFA NEW MATERIAL
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