Temperature chamber processing method and temperature chamber

A processing method and vapor chamber technology, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of insufficient structural strength of vapor chamber, poor heat dissipation effect, and high manufacturing cost. To improve the heat dissipation effect, not easy to sag the board body, and realize the effect of ultra-thin

Active Publication Date: 2022-07-01
AAC TECH NANJING
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  • Application Information

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Problems solved by technology

VaporChamber (VC) is an ideal solution to the heat dissipation problems of various electronic products at present, but the vapor chamber in the prior art not only has high manufacturing cost, poor heat dissipation effect, but also insufficient structural strength of the vapor chamber. The plate is prone to collapse after being heated and softened during use

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  • Temperature chamber processing method and temperature chamber
  • Temperature chamber processing method and temperature chamber
  • Temperature chamber processing method and temperature chamber

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Embodiment Construction

[0037]The technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present invention.

[0038] see figure 1 , figure 1 This is a first schematic flow chart of the method for processing a vapor chamber provided in an embodiment of the present invention. The vapor chamber has a hot end in contact with the heat source and a cold end away from the heat source, the direction from the hot end to the cold end is the first direction, and the direction perpendicular to the first direction is the second direction. The method for processing the vapor chamber comprises the following steps:

[0039] 101, the step...

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Abstract

The invention provides a method for processing a temperature equalizing plate, comprising: providing a first cover plate provided with a first groove and a second cover plate provided with a second groove; cold spraying the first cover plate to forming a first capillary structure in the first groove; cold spraying the second cover plate to form a first capillary unit in the second groove; cold spraying the first capillary unit to form a first capillary unit on the first capillary unit Two capillary units, the cross-sectional area of ​​the first capillary unit is larger than the cross-sectional area of ​​the second capillary unit in the direction from the hot end of the vapor chamber to the cold end; the first cover plate and the second cover plate are covered to make the The first capillary structure is in contact with the second capillary unit, and the first cover plate and the second cover plate are fixedly connected to form a closed inner cavity between the first cover plate and the second cover plate. The method for processing an equalizing plate provided by the invention can reduce the manufacturing cost of the equalizing plate, improve the structural strength of the equalizing plate, and improve the heat dissipation effect of the equalizing plate.

Description

【Technical field】 [0001] The present invention relates to the technical field of heat dissipation, and in particular, to a method for processing a temperature chamber and a chamber. 【Background technique】 [0002] With the development of electronic and electrical technology and the improvement of user needs, various electronic products in daily life, scientific research, science and education have more and more functions and higher power, and the heat of electronic products is becoming more and more serious. Vapor Chamber (VC) is an ideal solution to solve the heat dissipation problem of various electronic products at present, but the vapor chamber in the prior art not only has high manufacturing cost, poor heat dissipation effect, but also has insufficient structural strength. The plate body is prone to collapse after being heated and softened during use. [0003] Therefore, it is necessary to provide a new vapor chamber and its manufacturing method to solve the above-ment...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/00H05K7/20
CPCB23P15/00H05K7/20336
Inventor 余永水
Owner AAC TECH NANJING
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