The invention discloses an
assembly process method for a 3D PLUS encapsulating device, and aims to provide an
assembly method, which is simple and efficient and contributes to the realization of stable and reliable quality in order to solve the problems of freeness from
soldering tin infiltration on the root part of a device pin and failure in meeting certain standards caused by current manual
assembly. According to the technical scheme, the method comprises the following steps: printing
soldering paste on a printed board bonding pad by using a steel mesh and finishing device mounting through printing and mounting technologies in an SMT (
Surface Mount Technology) assembly technology, printing the
soldering paste on the printed board bonding pad, controlling the thickness of the soldering paste printed on the printed board bonding pad at 0.12
millimeter through the thickness of the steel mesh, finishing device mounting by using a maintenance
workstation, controlling the
lateral deviation of the device pin within 15 percent of the pin width, and fixing
diagonal pins of the 3D PLUS encapsulating device through
spot welding by using
soldering iron after mounting; performing non-contact integral board preheating on the bottom of the printed board by using a heating stage
welding technology and a tool
gasket; and after preheating time is reached, manually heating the exposed pins of the device by using the
soldering iron, and melting the soldering
tin through
thermal conduction to finish
welding.