Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

121results about How to "Enhanced capillary action" patented technology

Double-wall sandwich structural microcapsule self-repairing rubber and preparation method thereof

The invention provides a double-wall sandwich structural microcapsule self-repairing rubber and a preparation method thereof, and relates to a rubber and a preparation method thereof. The preparation method comprises the step of sequentially mixing a rubber matrix, stearic acid, zinc oxide, an accelerant, an anti-aging agent, carbon black, paraffin, a double-wall sandwich structural self-repairing microcapsule and a nano mesoporous molecular sieve in proportion, wherein the double-wall sandwich microcapsule is utilized and adopts urea-formaldehyde resin as the wall material, so that the sealing performance is high, and the manufactured walls have moderate hardness; the nano mesoporous molecular sieve utilized as a synergist is naturally inorganic filler which can improve the mechanical performance of the rubber, and a double coating brings higher heat-resisting stability, therefore, the contact probability of a repairing agent and the catalyst is greatly increased, and the influence of excessively added repairing agents and catalysts to the mechanical performance of the rubber can be avoided. Once microcrack appears in the material, a plurality of pores act to improve the capillary siphon effect of the microcrack to the microcapsule, thus the probability of the repairing agent and the curing agent to enter the microcrack is greatly increased, and as a result, the repairing effect is greatly improved.
Owner:沈阳双骥橡塑科技有限公司

Soaking plate

The invention discloses a soaking plate comprising an evaporation plate, a condensation plate and a connecting plate. The evaporation plate directly faces the condensation plate. The connecting plateis used for connecting the evaporation plate with the condensation plate so as to form a closed cavity, and the closed cavity is filled with a working medium. The evaporation plate is provided with channels for conveying the working medium, and the channels are distributed in the circumferential direction of the evaporation plate and are divergent from the center to the edge of the evaporation plate. According to the soaking plate, the evaporation plate and the condensation plate are provided with bionic vein polygon micro-channel structures, the wall faces of the channels of the evaporation plate and the periphery of support columns are covered with lyophilic liquid sucking cores, thus the wall faces have lyophilic performance, capillary performance of the channel liquid sucking cores isimproved, and liquid sucking speed of the channel liquid sucking cores is increased. The wall faces of the channels of the evaporation plate and the periphery of the support columns are covered with lyophilic materials, liquid spreading is achieved progressively from the edge to the center of the condensation plate, the downward circulation speed of the working medium in main channels is increased, a working medium backflow path is shortened, working medium backflow speed is increased, and heat dissipation benefits are increased.
Owner:GUANGDONG UNIV OF TECH

Imbibition chip, imbibition core and plate type integrated hot pipe

The invention relates to a fluid suction chip, fluid suction cores and a flat integrated heat pipe; wherein, the fluid suction chip is used for being arranged in the integrated heat pipe to form a fluid suction core with capillary capacity, particularly including that: a metal sheet is flatly overlaid and treated with braze welding for being connected into the fluid suction core and a hole used for guiding condensate to flow back is arranged on the metal sheet. The fluid suction core adopts the fluid suction chip of the invention and the hold is communicated from one end of the fluid suction core to the other end and used for guiding the condensate to flow back. The flat integrated heat pipe comprises two shell bodies which are buckled to form a sealed cavity and a fluid suction core is welded on the inner wall of the shell body in level; a support component is also welded between the inner wall of the shell body and the fluid suction core. The composite fluid suction core structure is integrated with the braze welding of the shell body of the flat integrated heat pipe so as to ensure strong capillary capacity, low flow resistance and good mechanical property of the shell bodies; the product cost can be reduced by utilizing materials with low cost to prepare the shell bodies and simultaneously good heat dissipation can reduce the restricts on the development of electronic components.
Owner:DALIAN GOLDEN THERMALWAY TECH +1

Assembly process method for 3D Plus encapsulating device

ActiveCN104540333AEnhance capillary effectGood solder joint consistencyPrinted circuit assemblingSolder pasteEngineering
The invention discloses an assembly process method for a 3D PLUS encapsulating device, and aims to provide an assembly method, which is simple and efficient and contributes to the realization of stable and reliable quality in order to solve the problems of freeness from soldering tin infiltration on the root part of a device pin and failure in meeting certain standards caused by current manual assembly. According to the technical scheme, the method comprises the following steps: printing soldering paste on a printed board bonding pad by using a steel mesh and finishing device mounting through printing and mounting technologies in an SMT (Surface Mount Technology) assembly technology, printing the soldering paste on the printed board bonding pad, controlling the thickness of the soldering paste printed on the printed board bonding pad at 0.12 millimeter through the thickness of the steel mesh, finishing device mounting by using a maintenance workstation, controlling the lateral deviation of the device pin within 15 percent of the pin width, and fixing diagonal pins of the 3D PLUS encapsulating device through spot welding by using soldering iron after mounting; performing non-contact integral board preheating on the bottom of the printed board by using a heating stage welding technology and a tool gasket; and after preheating time is reached, manually heating the exposed pins of the device by using the soldering iron, and melting the soldering tin through thermal conduction to finish welding.
Owner:10TH RES INST OF CETC

Foundation heating device and construction method for foundation heating combined vacuum prepressing of soft soil foundation by applying such device

The invention discloses a foundation heating device and a construction method for foundation heating combined vacuum prepressing of a soft soil foundation by applying such device. Vertical plastic draining plates are arranged in a foundation, plate heads of the vertical plastic draining plates are connected to transversely arranged filter pipes, outlet ends of all filter pipes are communicated with an inlet of a pressure guiding flow separating device, heating devices are further arranged in the foundation, a sand cushion layer is paved on the foundation, the filter pipes are buried in the sand cushion layer, a thermal insulation layer is paved on the sand cushion layer, and a sealing film is paved on the thermal insulation layer to form a closed vacuum prepressing system. During work, the pressure guiding flow separating device is firstly opened to perform foundation reinforcing treatment by a general vacuum prepressing method; when general drainage consolidation is performed to the later stage, a temperature control heating body is opened to perform foundation heating, meanwhile the foundation is vacuumized, and by controlling a foundation heating temperature and a foundation absolute pressure, water content in the foundation is converted to a gas state from a liquid state, and therefore, the water content of the foundation is further reduced, and the strength of the foundation is increased.
Owner:TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products