Compressed mesh wick, method for manufacturing same, and plate type heat pipe including compressed mesh wick

a technology of mesh wick and heat pipe, which is applied in the direction of cooling/ventilation/heating modification, semiconductor/solid-state device details, semiconductor devices, etc., can solve the problems of shortened life time deterioration of electric or electronic parts, and remarkably small electronic devices represented by personal computers or the lik

a technology of mesh wick and heat pipe, which is applied in the direction of cooling/ventilation/heating modification, semiconductor/solid-state device details, semiconductor devices, etc., can solve the problems of shortened life time deterioration of electric or electronic parts, and remarkably small electronic devices represented by personal computers or the lik

US20010004934A1Inactive Publication Date: 2001-06-28FURUKAWA ELECTRIC CO LTD
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  • Compressed mesh wick, method for manufacturing same, and plate type heat pipe including compressed mesh wick
  • Compressed mesh wick, method for manufacturing same, and plate type heat pipe including compressed mesh wick
  • Compressed mesh wick, method for manufacturing same, and plate type heat pipe including compressed mesh wick

Examples

Experimental program
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example

Example 1

[0099] As shown in FIG. 1(a), ten sheets of band type mesh wire, each of which sheet has a thickness of 110 micron meter, a width of 100 mm, a length of 663 mm and 100 meshes were layered. Then, the end of thus layered sheets were aligned with a metal plate having a width of about 48 mm. Then, as shown in FIG. 1(b), the layered sheets of the band type mesh wire were wound around the metal plate. Then, the metal plate was removed from the wound mesh body, and as shown in FIG. 1(c), the force of 150 to 200 kgf / cm2 was applied so as to press the wound mesh body. Thus, the compressed mesh wick of about 51 mm.times.100 mm was prepared. The thickness of the compressed mesh wick was up to about 1.5 mm. The end portion of the wound mesh wick was prepared in such manner that the length of the end portion was about 5 mm from the tip of the side portion of the compressed mesh wick, as shown in FIG. 1(d). As a result, it was possible to remarkably reduce the gap between the layers of t...

example 2

[0101] As shown in FIG. 2A(a), ten sheets of band type mesh wire, each of which sheet has a thickness of 110 micron meter, a width of 100 mm, a length of 663 mm and 100 meshes were layered. Then, as shown in FIG. 2A(b), a corrugated bent layered mesh body was prepared by bending the band type mesh wire in a corrugated form. Then, as shown in FIG. 2A(c), the force of 150 to 200 kgf / cm2 was applied to the corrugated bent layered mesh body so as to press same. Thus, the compressed mesh wick of about 51 mm.times.100 mm was prepared. The thickness of the compressed mesh wick was up to about 1.5 mm. As a result, it was possible to remarkably reduce the gap between the layers of the mesh wire. In addition, fine wires were not protrude outward and scattered.

[0102] Thus prepared compressed mesh wick was press-attached to the inner wall of the heat dissipating side and the side wall of the heat transfer block by the spot welding, as shown in FIG. 6. As a result, the heat pipe having excellent...

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Abstract

A compressed mesh wick prepared by bending for plurality of times at least one sheet of band type mesh wire to form a prescribed shape, thus preparing a bent layered mesh body, and pressing the bent layered mesh body.

Description

[0001] 1. Field of the Invention[0002] The present invention relates to a plate type heat pipe for cooling various electronic components such as semiconductor chips or the like, a mesh wick used for a plate type heat pipe, and in particular, relates to a mesh wick comprising multiple mesh wire sheets, a method for manufacturing same, and a plate type heat pipe using same in which the container is light weighted, is not deformed by a vapor pressure of a working fluid, and has a low heat transfer resistance.[0003] 2. Description of the Related Art[0004] Electric or electronic parts such as semiconductor chips or the like generate heat to some extent, when used, which are mounted on various devices such as personal computers and electric or electronic devices such as power equipment. The function of the electric or electronic parts deteriorates and the life time thereof is shortened, when the electric or electronic parts are excessively heated. Lately, the electronic devices represente...

Claims

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Application Information

Patent Timeline
28 Jun 2001
Publication
US20010004934A1
IPC
F28D15/02; F28D15/04; H01L21/48; H01L23/427; H05K7/20
CPC
F28D15/0233; F28D15/046; H01L21/4878; H01L23/427; H01L2924/0002; H01L2924/00
Inventors
YAMAMOTO, MASAAKI; UEKI, TATSUHIKO