Heat pipe

Abstract

The invention provides a heat pipe, comprising a heat conductor, working fluid and a carbon nanotube array; wherein, the heat conductor comprises a first metal cover, a second metal cover and two third metal covers; the first metal cover and the second metal cover are correspondingly arranged to form a front opening end and a back opening end; the first metal cover and the second cover are respectively provided with a groove, and the opposite sides thereof are respectively extended out to form two thin metal flanges; the bottom of each groove is provided with a microchannel, and two supporting plates are arranged in each groove near the two sides; the two third metal covers are respectively buckled on the front opening end and the back opening end to form a vacuum sealing space in the heat conductor. The carbon nanotube array is fixed in the microchannel. The working fluid is filled into the heat conductor. The heat pipe of the invention uses flat metal covers internally provided with a microchannel and fixes carbon nanotube in the microchannel to increase the heat conductivity and capillary capacity and improve heat conductivity of the heat pipe.

Description

technical field [0001] The invention relates to a heat exchange device, in particular to a heat pipe. Background technique [0002] With the development of natural science and engineering technology, small electronic products such as personal computers, workstations, and handheld computers have sprung up like mushrooms after rain. In these electronic products, small heat pipes are needed to cool the heat-generating devices, so they are small in size, light in weight, and efficient. High is the most important indicator of these small heat pipes. Current heat pipes are usually in a tubular structure. Since the contact area between the tubular heat pipe and the heat source is very small, the heat dissipation efficiency is not high, so it is not suitable for the heat dissipation of such small electronic products. Some manufacturers directly flatten small tubular heat pipes to increase the contact area between the heat pipe and the heat source, but the process of flattening usua...

AI Technical Summary

Problems solved by technology

The current heat pipe is usually a tubular structure. Since the contact area between the tubular heat pipe and the heat source is very small, the heat dissipation efficiency is not high, so it is not suitable for the heat dissipation of such small electronic products.

Some manufacturers directly flatten small tubular heat pipes to increase the contact area between the heat pipe and the heat source, but the process of flattening usually causes damage to the internal structure of the heat pipe and a decrease in heat transfer efficiency

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