Soakage device capable of reinforcing supporting strength and capillary action

A technology of capillary action and support strength, applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve problems such as increasing weight, weakening structural stability, and sharply reducing heat dissipation efficiency, to achieve enhanced support strength, The effect of improving structural safety

Inactive Publication Date: 2009-07-01
TAMKANG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. A large steam chamber V lacks a supporting structure except for the side walls, which will weaken its structural stability
[0007] 2. When the working fluid evaporates upward, part of the steam will drop directly due to gravity after condensation and collide with the rising steam flow, which will affect the thermal convection cycle operation of the evaporation and condensation of the working fluid, and sharply reduce its heat dissipation efficiency
[0008] 3. In order to strengthen its structural strength, the thickness of the side wall can be increased, but its weight will also be relatively increased, which will increase the weight of the overall electronic product, which does not conform to the popular trend of light, thin, short and small

Method used

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  • Soakage device capable of reinforcing supporting strength and capillary action
  • Soakage device capable of reinforcing supporting strength and capillary action
  • Soakage device capable of reinforcing supporting strength and capillary action

Examples

Experimental program
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Effect test

no. 1 example

[0037] refer to Figure 2 to Figure 4 , the heat spreader of the present invention (thermal spreader) comprises: casing 1 defines steam chamber or vapor chamber (vapor chamber) 10 in it, fills into the evaporable working fluid after vacuumizing; And reticular intersecting capillary structure 2 is located in the steam chamber 10 of the housing.

[0038] The casing 1 can be made of materials such as metal with good thermal conductivity, and includes: a first casing cover 11 and a second casing cover 12 . The second casing 12 covers the first cover 11 and defines a steam chamber 10 between the first and second cover 11 , 12 .

[0039] Capillary thin layers 111, 121 can be connected to the inside of each of the shell covers 11, 12, and the capillary thin layers 111, 121 are selected from: metal (such as copper) mesh, sintered film, powder metallurgy thin layer, and other capillary thin layers . The thin capillary layers 111 , 121 can be welded, glued, and other connection metho...

no. 2 example

[0056] The second embodiment of the present invention is shown in Figure 5 Among them, the reticular intersecting capillary structure 2 "two-in-one" the aforementioned vertical grid plate 21 and horizontal grid plate 22, that is, the vertical grid bar 211 and the longitudinal capillary hole 212 are formed at the lower part of the frame body 20, and the Horizontal grid strips 221 and transverse capillary holes 222 are formed on the upper part to simplify the manufacturing and installation procedures. The fluid connecting pipe 3 directly passes through the frame body 20 and communicates with the capillary holes.

no. 3 example

[0058] Such as Figure 6 As shown, the vertical and horizontal grids 21, 22 are respectively surrounded by the frame body 20 to define the evaporation chamber 10 in the vertical grid plate 21 and the horizontal grid plate 22, and the frame body 20 doubles as the shell of the heat equalizing device of the present invention The body 1, that is, the casing 1 combined by the first and second casing covers 11, 12 is eliminated, and the fluid connection 3 is in fluid communication with the evaporation chamber 10.

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PUM

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Abstract

The invention provides a soaking device capable of enhancing support strength and capillary action. The device comprises a casing; a vapor chamber is defined in the casing, and filled with an evaporable working fluid after vacuumized; a net-shaped cross capillary structural body is arranged in the vapor chamber of the casing. Meanwhile, by means of crisscrossed capillary holes, the capillary action of the working fluid in a cavity body is enhanced; multipoint and multidirectional soaking and radiating effects can be achieved; a heating element which is in contact with the soaking device is quickly and effectively dissipated; in addition, the net-shaped cross capillary structural body presents a cross-linking mechanical structure, the support strength can be enhanced, and the structural stability of related products is promoted.

Description

technical field [0001] The invention relates to a heat equalizing device capable of enhancing support strength and capillary action. Background technique [0002] Insufficient cooling of the heat generated by electronic products during operation will increase the operating temperature and degrade the performance and reliability of electronic products. Therefore, the "thermal management" (thermal management) of electronic products is becoming more and more important. [0003] Commonly used heat dissipation methods include using heat sink radiators, heat dissipation fans, heat pipes, water-cooled heat dissipation modules and other heat dissipation mechanisms, modules or methods to dissipate heat from electronic products or semiconductor products. [0004] Such as figure 1 Shown is a known vapor chamber (vapor chamber) V, the bottom surface of which is overlapped with a heating element C (such as a CPU, semiconductor product or other heat source), and its upper surface is conn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/427
Inventor 康尚文蔡孟昌
Owner TAMKANG UNIVERSITY
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