Imbibition chip, imbibition core and plate type integrated hot pipe

Abstract

The invention relates to a fluid suction chip, fluid suction cores and a flat integrated heat pipe; wherein, the fluid suction chip is used for being arranged in the integrated heat pipe to form a fluid suction core with capillary capacity, particularly including that: a metal sheet is flatly overlaid and treated with braze welding for being connected into the fluid suction core and a hole used for guiding condensate to flow back is arranged on the metal sheet. The fluid suction core adopts the fluid suction chip of the invention and the hold is communicated from one end of the fluid suction core to the other end and used for guiding the condensate to flow back. The flat integrated heat pipe comprises two shell bodies which are buckled to form a sealed cavity and a fluid suction core is welded on the inner wall of the shell body in level; a support component is also welded between the inner wall of the shell body and the fluid suction core. The composite fluid suction core structure is integrated with the braze welding of the shell body of the flat integrated heat pipe so as to ensure strong capillary capacity, low flow resistance and good mechanical property of the shell bodies; the product cost can be reduced by utilizing materials with low cost to prepare the shell bodies and simultaneously good heat dissipation can reduce the restricts on the development of electronic components.

Description

technical field [0001] The invention relates to the technical field of heat transfer, mass transfer and heat dissipation, in particular to a heat-absorbing chip, a liquid-absorbing core formed by the heat-absorbing chip, and a plate-type integrated heat pipe using the liquid-absorbing core. Background technique [0002] The heat pipe is a component that uses the phase change process of the liquid to carry the latent heat of vaporization to improve the heat transfer capacity of the radiator, and has been widely used in the field of electronic engineering. With the development of electronic components in the direction of miniaturization, integration and high power, the heat dissipation capacity of electronic components is becoming the bottleneck of its development. Therefore, the heat dissipation performance requirements of electronic components for heat dissipation structures have been significantly improved. The heat transfer and heat dissipation capabilities of the componen...

AI Technical Summary

Problems solved by technology

However, this form of integrated heat pipe also has certain defects: due to technological reasons, the metal sheet cannot be processed too thin, so the gap between the sheets will be small, resulting in a small porosity in the integrated heat pipe

Affected by porosity, the ability of the integrated heat pipe to transport condensate is poor, and it is easy to cause dryness when absorbing a large amount of heat, which limits the application of high-power heat dissipation devices

[0006] Therefore, the various VC or integrated heat pipes in the prior art cannot take into account the two elements of strong heat transfer capacity of the liquid-absorbing core and good support performance for the shell. It is difficult to obtain integrated heat pipes with complex cavity designs, and it is impossible to use low-cost The shell is made of low-strength materials, and the cost is high

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