Rapid alignment detection device and method based on universal BGA ball mounting ball plate
A technology of alignment detection and ball plate, which is applied to measurement devices, optical devices, instruments, etc., can solve the problems of poor alignment accuracy, long alignment time, and low alignment efficiency.
Active Publication Date: 2021-05-07
深圳市立可自动化设备有限公司
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Problems solved by technology
When using this method for alignment, the alignment accuracy is poor, and the alignment time is long, resulting in low alignment efficiency
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[0027] The claims of the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work also fall within the protection scope of the present invention.
[0028] It should be understood that, in the descriptions of the embodiments of the present invention, all directional terms, such as "up", "down", "left", "right", "front", "rear", etc. indicate the orientation or position The relationship is based on the orientation and positional relationship shown in the drawings or the conventional orientation or positional relationship of the product of the invention in use, which is only for the convenience of simplifying the description of the present invention, rather ...
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The method is suitable for the technical field of chip packaging BGA ball mounting. The invention discloses a rapid alignment detection device and method based on a universal BGA ball mounting plate. The device comprises: a light source fixing seat which is disposed between an upper ball plate and a lower ball plate during detection, and is provided with an upper alignment light source and a lower alignment light source; and a light source controller which controls the two alignment light sources to emit light and receives and processes the intensity of reflected light signals obtained by the reflected light sources. The upper alignment light source and the lower alignment light source are located on the same straight line, and when the upper alignment light source and the lower alignment light source are coaxial with the corresponding upper and lower ball plate micropores at the same time, the upper and lower ball plates are aligned. During use, the light source fixing seat is placed between the upper ball plate and the lower ball plate, the lower alignment light source is coaxial with the micropores in the lower ball plate and the micropores in the upper ball plate at the same time, and the two ball plates are aligned. As whether the micropores in the two ball plates are aligned or not can be rapidly detected, the alignment detection time is shortened, and the alignment detection efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of chip packaging BGA ball planting, in particular to a device and method for quick alignment detection of general-purpose BGA ball planting boards. Background technique [0002] The chip package usually adopts BGA (Ball Grid Array, ball grid array package), and the solder balls are transplanted to the points corresponding to the chip pins. Because different chips have different ball grid array specifications, when packaging different chips, only the ball plate corresponding to the different ball grid array package needs to be replaced, and other parts of the ball planting device do not need to be changed. Due to the extremely high precision requirements in the chip packaging process, the positions of the upper and lower balls must be accurately aligned each time the ball is replaced, otherwise, the solder balls in the densely distributed solder ball holes on the lower ball will be on the upper ball. During...
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IPC IPC(8): G01B11/27
CPCG01B11/27
Inventor 谢交锋张波覃士省利保宪龚天祥
Owner 深圳市立可自动化设备有限公司