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Integrated packaging display module, its repair method, and display device

A display module and integrated packaging technology, which can be used in identification devices, instruments, semiconductor devices, etc., and can solve problems such as affecting display effects.

Active Publication Date: 2022-04-15
UNILUMIN GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on this, it is necessary to provide an integrated packaging display module, its repair method, and a display device for the problem that the color change of the colloid after repairing local dead pixels of the integrated packaging display module affects the display effect.

Method used

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  • Integrated packaging display module, its repair method, and display device
  • Integrated packaging display module, its repair method, and display device
  • Integrated packaging display module, its repair method, and display device

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Embodiment Construction

[0027] In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0028] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" a...

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Abstract

This application relates to an integrated packaging display module and its repair method and display device. The repair method of the integrated packaging display module includes the steps of: reducing the overall adhesive surface of the integrated packaging display module to a preset thickness; removing the adhesive at the bad point at a fixed point ; Carry out rework treatment on bad pixels; Carry out glue sealing treatment on the whole surface of the integrated package display module. Ingeniously designed the three-step rework method of thinning first, then patching holes, and finally restoring, especially suitable for integrated packaging display modules that are becoming more and more dense and even the dot pitch is less than 1 mm, and can be reworked in a very small limited space. After thinning Cooperating with the whole surface sealing glue, it is beneficial to better ensure the overall display effect of the integrated package display module, which not only helps to solve the feasibility of integrated package repair, but also helps to ensure the reliability of repair and the consistency of appearance and color after repair, and improves Improve the rework efficiency and overall display stability, and realize the reworkable and scalable mass production of integrated packaging display modules.

Description

technical field [0001] The application relates to the field of small-pitch LED displays, in particular to an integrated packaging display module, a repair method thereof, and a display device. Background technique [0002] With the development of indoor small-pitch LED display technology, in order to achieve smaller pixel pitch and higher reliability requirements, integrated packaged indoor small-pitch LED display products emerged as the times require, integrated packaged indoor small-pitch LED display products One way is to apply COB (Chip On Board, chip on board) light source. COB light source is a high-efficiency integrated surface light source technology that directly pastes LED chips on a mirror metal substrate with high reflectivity. This technology eliminates the concept of brackets, no electroplating, no reflow soldering, and no SMT process, so the process is reduced by nearly 30% One, the cost is also saved by one-third. The COB process is first to cover the place...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52H01L25/16G09F9/33
CPCH01L33/48H01L33/52H01L25/167G09F9/33H01L2933/0033H01L2933/005
Inventor 胡新喜孙天鹏张金刚张世诚
Owner UNILUMIN GRP