Method for Determining Crystal Line of Silicon Crystal Bar, Method for Finding Square and Equipment for Finding Square

Abstract

The present invention relates to the technical field of cutting hard and brittle bars, and in particular to a method for determining the crystal line of a silicon crystal bar, a method for finding a square, and a square finding device, wherein the method for determining the crystal line of a silicon crystal bar uses a clamping device equipped with a rotary top clamping mechanism Mechanism, the rotary top clamping mechanism clamps the silicon crystal bar by tightening the two ends of the silicon crystal bar. There are multiple sensors around the rotary top clamping mechanism. The sensor can take pictures of the end surface and shoot through each sensor The complete image of the cross-sectional circle outside the end surface is obtained by the local image synthesis, and the coordinates of the crystal line are further identified, and the position of the crystal line on the silicon crystal bar during actual cutting is found through coordinate conversion. The setting of the clamping mechanism in this scheme can help to quickly detect the crystal line position of the silicon crystal bar, provide a cutting method that can accurately find the crystal line of the single crystal silicon bar, and simplify the processing technology of the silicon crystal bar. And it can effectively improve the quality of the square root of the silicon crystal bar.

Description

technical field [0001] The invention relates to the technical field of cutting hard and brittle bars, in particular to a method for determining crystal lines of silicon crystal bars, a square finding method and square finding equipment. Background technique [0002] The method of finding the crystal line in the prior art is generally to install a sensor on the side of the crystal rod, the sensor is perpendicular to the axis of the crystal rod, and the crystal rod needs to be rotated by 360°, so that through the data collected many times continuously, Find the crystal line at the high point through difference analysis, generate coordinates, and then connect the coordinates of the four points virtually, control the crystal rod clamping mechanism to rotate the single crystal silicon rod, and cut the diamond wire from the reference position of the virtual connection. Many times, the process is more troublesome. [0003] And this method of finding the crystal line is more suitab...

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Problems solved by technology

[0004] For this reason, it is necessary to provide a method for determining the crystal line of a silicon crystal ingot, a method for determining a square, and a method for obtaining a square, so as to solve the problems in the prior art that the silicon crystal ingot process is troublesome and the cutting accuracy is low, which easily leads to the scrapping of the silicon ingot.

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