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Cutting apparatus, tray, and transport system

A cutting device and pallet technology, applied in the field of conveying systems, can solve the problem of wasting time and achieve the effect of efficient loading and unloading

Pending Publication Date: 2021-10-12
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a good chance of wasting time when loading and unloading plates relative to the sub-chuck table

Method used

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  • Cutting apparatus, tray, and transport system
  • Cutting apparatus, tray, and transport system
  • Cutting apparatus, tray, and transport system

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0051] figure 1 It is a perspective view showing the internal structure of a processing device (cutting device) 4 for processing (cutting) a plate-shaped workpiece 11 . Also, the X used in the following descriptions 2 Axis direction, Y 2 Axis direction and Z 2 The axis directions are approximately perpendicular to each other. Such as figure 1 As shown, the processing apparatus 4 has a base 202 that supports each component.

[0052] A recessed portion 202a is formed at a corner of the base 202, and an elevating table 204 that is raised and lowered by an elevating mechanism (not shown) is disposed in the recessed portion 202a. For example, a container (cassette) 102 of a transport vehicle 10 , which will be described later, capable of storing a workpiece 11 , a plate 31 , and the like, is placed in a loading area A on the upper surface of the lift table 204 . In addition, a plurality of position limiting members (not shown) for limiting the horizontal position of the conta...

no. 2 Embodiment approach

[0417] In this embodiment, a processing device (cutting device) in a mode different from the above-described embodiment will be described. Figure 35 It is a perspective view showing the internal structure of the processing device (cutting device) 402 of this embodiment. In addition, in the following description, the same code|symbol is attached|subjected to the component common to the said embodiment, and detailed description is abbreviate|omitted.

[0418] The container 102 of the transport vehicle 10 is not placed on the lift table 404 of the processing device 402 . Instead, on the elevating table 404 of the processing device, the same two-stage cassette storage mechanism 24 (that is, the first cassette storage mechanism 24a and the second cassette storage mechanism 24b) as the loader / unloader 8 of the above-mentioned embodiment is provided. Two-stage cassette storage mechanism 406 (1st cassette storage mechanism 406a and 2nd cassette storage mechanism 406b).

[0419] Tha...

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PUM

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Abstract

The invention provides a cutting apparatus, a tray and a transport system. The cutting apparatus can efficiently assemble and disassemble a board relative to a sub-chuck table. A cutting apparatus includes a chuck table having a holding surface used for holding either a workpiece unit that includes a plate-shaped workpiece supported on an annular frame by a tape or a tray shaped similarly to the annular frame, a rest area used for placing a receptacle that houses the workpiece unit or the tray, a transport unit configured to transport the workpiece unit or the tray between the rest area and the chuck table, the transport unit having a holding pad that holds the workpiece unit or the tray, a sub-chuck table that is disposed sideways of the chuck table and has a holding surface used for holding a board for use in adjusting a cutting unit, and a board transport unit configured to transport the board between the tray held on the chuck table and the sub-chuck table.

Description

technical field [0001] The present invention relates to a cutting device used when processing a plate-shaped workpiece, a pallet used in the cutting device, and a conveyance system used for conveying the workpiece to the cutting device. Background technique [0002] When dividing a plate-shaped workpiece represented by a semiconductor wafer into a plurality of chips, for example, a cutting device equipped with a ring-shaped cutting blade is used. The workpiece can be cut along the moving path by relatively moving the cutting blade and the workpiece while cutting the cutting blade rotating at high speed into the workpiece. [0003] However, immediately after the cutting tool is attached to the main shaft as the axis of rotation, there is a high possibility that the cutting tool is off-centered with respect to the main shaft, or the cutting tool is not sharp enough. Therefore, prior to cutting the workpiece, an operation called dressing is performed in which the cutting tool ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/02B28D7/00B28D7/04H01L21/304H01L21/677H01L21/673
CPCB28D5/022B28D5/0064B28D5/0082B28D5/0094H01L21/304H01L21/67766H01L21/67778H01L21/67333H01L21/67092H01L21/67775H01L21/67769H01L21/67772H01L21/67386H01L21/67353H01L21/67379B23Q5/22
Inventor 关家一马
Owner DISCO CORP
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