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Die ejector height adjustment

A technology of ejector and tube core, which is applied in the manufacture of semiconductor devices, electric solid devices, semiconductor/solid devices, etc., and can solve problems such as damage

Pending Publication Date: 2021-11-19
ASM TECH SINGAPORE PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Semiconductor dies or chips are often fragile components that can be damaged if exposed to the ejector assembly of an ejection device

Method used

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  • Die ejector height adjustment
  • Die ejector height adjustment
  • Die ejector height adjustment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Before discussing the embodiments in more detail, a general description of the apparatus and methods according to the invention will be provided. Embodiments provide a method of adjusting a die ejection apparatus or module operable to eject a die from a support. Processing of a die or chip often requires a step of separating the die from the support. The support is usually a wafer ribbon. The ejection device in the form of an ejection module is configured to allow repeated and stable picking of dies from the wafer tape. For example, the separation of the die from the wafer ribbon allows the die to be further processed. The successful separation of the die from the wafer tape allows the process to reduce the chance of defects (eg, die cracks, pin marks, and the like) on the die from the ejection process.

[0040] Figure 1A and Figure 1B The general operation of a typical die ejection apparatus is schematically shown. Such as Figure 1A Each individual die 10 is sh...

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PUM

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Abstract

A die ejection apparatus operable to eject a die from a support has at least two ejector components configured to lift a die located on the support. The ejector components are moveable to a position in which a lifting force is exertable by the ejector components on the support, so as to lift a die located on the support. Movement of the die ejector components is initiated towards the support, and a moment when each of the die ejector components reaches the position is determined. A height offset of each die ejector component relative to a height of another die ejector component is determined upon reaching the said position, and relative heights of the die ejector components are adjusted in dependence upon the evaluated height offset.

Description

technical field [0001] The invention relates to a method of conditioning a die ejection device operative to eject a die from a support. Background technique [0002] During the production of semiconductor dies or chips, many semiconductor dies are formed together on a single wafer. Subsequently, the wafer is diced to separate the individual dies. Each semiconductor die is then individually mounted onto a support surface for further processing. When it is mounted on a supporting surface, a series of processes can be performed on the semiconductor die or chip. [0003] It should be appreciated that it is often necessary to provide a mechanism to allow the die to move and separate the die from the support surface or wafer tape to which it is attached. For example, after a wafer mounted on a wafer adhesive tape is singulated into individual dies and the dies need to be picked up and bonded to another surface, the dies are typically separated from the support surface. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/683
CPCH01L21/68742H01L21/6836H01L21/67132B65G49/061B65G49/067B65G2249/02H01L21/6835H01L2221/68354H01L2221/68322H01L2221/68381H01L21/67259H01L21/681H01L2221/6839B29C45/4005
Inventor 郑志华丘允贤罗国斌
Owner ASM TECH SINGAPORE PTE LTD