Film stripping and cutting mechanism
A film peeling and cutting technology, applied in thin material processing, sending objects, lamination, etc., can solve the problems of poor half-cut control, uneven film sticking, uneven film, etc., to achieve convenient feeding work, convenient The effect of cutting work and convenient normal operation
Pending Publication Date: 2022-01-07
SHENZHEN BANGZHENG PRECISION MACHINERY CO LTD
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Problems solved by technology
[0003] However, the film half-cutting currently on the market is half-cutting before peeling off. The film peeling device uses the attachment head to directly absorb the coiled film. The coiled film moves away from the adsorption head with the peeling device. On the sticking head, the sticking head is then attached to the product after CCD alignment. In some cases, the half-cutting control is not good, and the cutting is overcut or not cut. Overcutting will cause the film roll to advance and interrupt the tape. Adhesion will occur during cutting, which will lead to lateral tension of the attachment head when peeling off the required film, resulting in unevenness on the film attachment head. There will also be unevenness on the head, resulting in deviation after being attached to the product, etc.
Method used
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[0027] In order to make it easy to understand the technical means, creation features, achieved goals and effects of the present invention, the present invention will be further described below with reference to the specific embodiments.
[0028] like Figure 1-Figure 9 As shown, a film peeling and cutting mechanism according to the present invention includes a base plate 1, a feeding mechanism 2 is installed on the base plate 1, a driving mechanism 3 is installed on the feeding mechanism 2, and a Pressing mechanism 6, upper cutting mechanism 4 is installed on described feeding mechanism 2, and lower cutting mechanism 5 is installed on described feeding mechanism 2, and described lower cutting mechanism 5 is positioned at upper cutting mechanism 4 below, and described bottom plate 1 is equipped with a peeling mechanism 7, and the feeding mechanism 2 is provided with a film coil 8.
[0029]Specifically, the feeding mechanism 2 includes a vertical plate 201, two vertical plates ...
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The invention relates to the technical field of film cutting, and particularly relates to a film stripping and cutting mechanism. The film stripping and cutting mechanism comprises a bottom plate, a feeding mechanism is installed on the bottom plate, a driving mechanism is installed on the feeding mechanism, a pressing mechanism is installed on the feeding mechanism, an upper cutting mechanism is installed on the feeding mechanism, a lower cutting mechanism is installed on the feeding mechanism, the lower cutting mechanism is located below the upper cutting mechanism, a stripping mechanism is installed on the bottom plate, and a film roll material is arranged on the feeding mechanism. The feeding mechanism works under the action of the driving mechanism, so that the film roll material can be conveniently placed and conveyed, and the film roll material is stably conveyed under the action of the pressing mechanism; and the upper cutting mechanism and the lower cutting mechanism are matched, so that the conveyed film roll material can be cut, the film roll material can be stripped under the action of the stripping mechanism, the roll material film can be well stripped, and the flatness of the film sucked by an attaching head is guaranteed.
Description
technical field [0001] The invention relates to the technical field of film cutting, in particular to a film peeling and cutting mechanism. Background technique [0002] Film is a thin and soft transparent sheet made of plastic, adhesive, rubber or other materials, mainly divided into optical film, cover film or CVL, composite film, superconducting film, polyester film, nylon film, plastic film etc. Thin films are widely used in electronics, machinery, printing and other industries. Thin film materials refer to thin metal or organic layers with a thickness ranging from a single atom to a few millimeters. Electronic semiconductor functional devices and optical coatings are the main applications of thin film technology , When using the film, it is necessary to peel and cut the film to facilitate the use of different products. [0003] However, the film half-cutting currently on the market is half-cutting before peeling. The film peeling device uses the attachment head to dire...
Claims
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Login to View More IPC IPC(8): B65H35/06B65H37/00B32B43/00
CPCB65H35/06B65H37/00B32B43/006B32B43/003
Inventor陈本誉占建俊黄成陈国灿张峻华
OwnerSHENZHEN BANGZHENG PRECISION MACHINERY CO LTD