Handling method of changing attributes of manufacturing processes for semi-conductor equipment

Abstract

A method is suitable for the system for controlling manufacturing processes of semi-conductor. The system at least includes the device data module storing attribute data of multiple manufacturing processes and the data module of the manufacturing processes storing the manufacturing process data relevant to the attribute data. Moreover, each manufacturing process data possesses at least, one established device code name. First, one attribute data of manufacturing process is changed to another attirubte data of manufacturing process. Then, the established device code name in the manufacturing process data located before the attribute data of manufacturing process is changed to the marker denoting the invalid device code name. The operation interface of the control system is unable to select the invalid device code name so as to prevent metallic cross contamination happened to chips in the device.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to a method for dealing with semiconductor equipment changing manufacturing process attributes, so as to prevent chips from being scrapped due to metal cross-contamination in devices with different manufacturing process attributes. Background technique [0002] In the complex semiconductor manufacturing process, the manufacturing process is generally divided into three attributes: front-end, middle-end, and back-end. The manufacturing process procedures (recipes) used in each manufacturing process attribute are different and the required cleanliness is also different. Generally speaking, the cleanliness of the front-end manufacturing process is high, while the cleanliness of the back-end manufacturing process is low due to the presence of metal impurities, so each manufacturing process attribute must have dedicated manufacturing process equipment, such as deposition equipment,...

AI Technical Summary

Problems solved by technology

In the traditional semiconductor control system, the operation interface (OPI) cannot distinguish whether the manufacturing process attributes of the equipment have changed, so it cannot prevent the occurrence of different manufacturing process attributes in the same equipment

In this way, if there is a product during the manufacturing period, due to human negligence, the manufacturing process before the property of the equipment has been changed due to human error will cause serious pollution and cause the product to be scrapped, resulting in a substantial increase in manufacturing costs

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