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Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing

A chemical-mechanical, surface-polishing technique used in the field of chemical-mechanical polishing systems

Inactive Publication Date: 2004-05-26
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Problems arise in CMP polishing because, the exposed values ​​vary, at each different exposed value the vertical profile of the polished wafer edge has different values

Method used

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  • Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing
  • Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing
  • Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing

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Embodiment Construction

[0038] The invention discloses a CMP system and method capable of precisely controlling the polishing of the exposed surface of a wafer. In order to solve the above problems, the present invention meets these needs by providing a CMP system and method that solves the above problems, wherein the structure and method are provided to allow the movement of the retainer relative to the plane of the wafer, but restrict the movement of the retainer so as to avoid causing the plane of the retainer to move relative to the plane of the wafer. Non-parallel tilt of the wafer plane. In such systems and methods, the retainer is movable relative to the plane of the wafer, but relative movement is limited. The direction of relative motion is restricted to a direction perpendicular to the plane of the wafer and the plane of the carrier. As a result, the plane of the wafer and the plane of the retainer can be coplanar for polishing the wafer. Also, the desired exposure value remains the same ...

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PUM

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Abstract

A CMP system and methods reduce a cause of differences between an edge profile of a chemical mechanical polished edge of a wafer and a center profile of a chemical mechanical polished central portion of the wafer within the edge. The wafer is mounted on a carrier surface (210) of a wafer carrier (210) so that a wafer axis (224) of rotation is gimballed for universal movement relative to a spindle axis (218) of rotation of a wafer spindle (220). A retainer ring (226) limits wafer movement on the carrier surface (210) perpendicular to the wafer axis (224). The retainer ring (226) is mounted on and movable relative to the wafer carrier (212). A linear bearing (230) is configured with a housing (320) and a shaft (326) so that a direction of permitted movement between the wafer carrier (212) and the retainer ring (226) is only movement parallel to the wafer axis (224), so that a wafer plane and a retainer ring (226) may be co-planar.

Description

1. Technical field [0001] The present invention relates generally to chemical mechanical polishing (CMP) systems and methods for improving the performance and efficiency of CMP operations. In particular, it relates to a gimbal-mounted plate carrying a wafer in which edge effects are reduced by aligning the wafer-engaging surface of the wafer-support plate with the wafer-polisher-engaging surface of the active retainer. 2. Background technology [0002] In the manufacture of semiconductor devices, it is necessary to perform chemical mechanical polishing (CMP) operations on semiconductor wafers, such as disk-shaped semiconductor wafers made of silicon and having a diameter of 200 mm or 300 mm. For ease of explanation, the technical term "wafer" used in the description below includes those semiconductor wafers, or other planar members, or substrates used to support electrical or electronic circuits. [0003] Integrated circuits can be formed on such wafers in multilayer struct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B37/16B24B37/32H01L21/304
CPCB24B37/32B24B37/16B24B37/04H01L21/304
Inventor M·A·萨尔达纳D·V·威廉斯
Owner APPLIED MATERIALS INC