Engine control circuit device

Abstract

An engine control circuit device which has higher heat resistance and can be installed in a place exposed to severe thermal environments. In an engine control circuit device comprising a circuit board on which a plurality of packaged electronic parts are mounted, and a connector mounted on the circuit board for connection to an external circuit, the device further comprises a resin portion formed of a thermo-setting resin and covering the connector except for a connecting portion thereof and the circuit board, and a cooling pipe integrally molded in the resin portion and allowing a coolant to flow through it, thereby cooling the resin portion.

Description

technical field [0001] The present invention relates to a circuit device having a circuit board mounted with a plurality of combined electronic components and a connector connected to an external circuit for mounting the circuit board, and more particularly to an engine installed in automobiles, ships, agricultural machinery, industrial machinery, etc. Control circuit device. Background technique [0002] In recent years, the thermal environment of modules that control engines (hereinafter referred to as engine control circuit devices) used in ships including automobiles, agricultural machines, and industrial machines has become increasingly severe. That is to say, the installation place of the engine control circuit device is changed from the interior of the car to the engine room, and the open engine is exposed to a high temperature environment. Moreover, as the control load increases in current, the calorific value increases, and the unit volume due to miniaturization inc...

AI Technical Summary

Problems solved by technology

[0007] That is, in the above-mentioned conventional technology, although it is not clearly described, the resin filled between the metal circuit board and the box case is a thermoplastic resin (this is because if a thermosetting resin is used, high-pressure injection is required, and the box case may be damaged) , In this way, for example, the general-purpose thermoplastic resin has a linear expansion coefficient of about 50ppm. Due to the large difference in thermal expansion coefficient with circuit boards, electronic components, and other structures, there is a possibility of damage to electronic components caused by thermal expansion.

Also, if the coefficient of linear expansion of the thermoplastic resin is to be lowered, the cost will increase

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