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Substrate dividing apparatus and method for dividing substrate

A technology for cutting equipment and substrates, which is applied in glass manufacturing equipment, glass cutting devices, metal processing equipment, etc., and can solve problems such as easy cracking

Inactive Publication Date: 2006-04-12
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] In the method for cutting a mother glass substrate, it is placed on the stage of a breaking device for performing a breaking step while vertically cracking the mother glass substrate by applying a bending moment along the formed cutting line The front and rear surfaces can be prone to chipping due to competing motion of the substrate

Method used

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  • Substrate dividing apparatus and method for dividing substrate
  • Substrate dividing apparatus and method for dividing substrate
  • Substrate dividing apparatus and method for dividing substrate

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Embodiment Construction

[0065] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0066] 1. Substrate cutting equipment

[0067] FIG. 1 shows the structure of a substrate cutting device 100 according to an embodiment of the present invention.

[0068] The substrate cutting apparatus 100 includes a table 31 , guide rails 32 , guide rails 33 , sliders 34 , sliders 35 , guide rods 36 , and linear motors 37 and 38 .

[0069] The substrate cutting apparatus 100 cuts the mother glass substrate 1 in order to manufacture a glass substrate for a liquid crystal display device.

[0070] Mother glass substrate 1 is placed on stage 31 .

[0071] The guide rail 32 and the guide rail 33 are provided in parallel on both sides of the table 31 . The slider 34 is provided on the guide rail 32 such that the slider 34 is slidable along the guide rail 32 .

[0072] The slider 35 is provided on the guide rail 33 so that the slider 35 is slidable ...

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Abstract

A substrate cutting apparatus for cutting a substrate, comprising: a cutting line forming device for forming a cutting line on a substrate; and a breaking mechanism for breaking the substrate along the cutting line. The breaking mechanism includes means for injecting thermal fluid at a temperature sufficient to expand the substrate over a cut line formed on the substrate such that vertical cracks extending from the cut line extend further in the thickness direction of the substrate.

Description

technical field [0001] The present invention relates to a substrate cutting apparatus and a substrate cutting method for cutting a substrate by forming a scribe line on a substrate and breaking the substrate along the scribe line. Background technique [0002] A liquid crystal display device includes a display panel having a liquid crystal interposed between a pair of mutually bonded glass substrates. The glass substrate included in the display panel is manufactured by cutting a mother glass substrate into glass substrates having a predetermined size, and then bonding the glass substrates together. [0003] The display panel is also manufactured by bonding large-sized mother glass substrates to each other to form bonded mother glass substrates, and then cutting each of the bonded mother glass substrates into glass substrates having a predetermined size. . [0004] Figure 20 A plurality of lines to be scribed formed on a conventional mother glass substrate used in the scri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00C03B33/023C03B33/027C03B33/033C03B33/04C03B33/09C03B33/10
CPCB28D5/0011C03B33/107C03B33/027C03B33/07C03B33/04C03B33/10C03B33/09C03B33/033C03B33/037Y10T225/304Y10T225/325B28D5/0047
Inventor 西尾仁孝
Owner MITSUBOSHI DIAMOND IND CO LTD