Method and apparatus for fabricating bonded substrate
A technology in substrates and substrates, applied in the field of manufacturing panels, which can solve the problems of improper bonding, decreased positional accuracy of substrates in vacuum processing chambers, and inability to maintain high airtightness of gaps between substrates.
Inactive Publication Date: 2006-07-05
FUJITSU LTD
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Problems solved by technology
Because of the variation of substrate and seal thickness, the outer seal cannot maintain a high airtightness of the inter-substrate gap where the substrates are bonded without being controlled to be parallel to each other
This also leads to improper bonding
[0012] 2. The influence on the substrate during bonding
Specifically, since a spacer (spherical, columnar, etc.) for adjusting the cell pitch to a predetermined value is provided on one substrate, if two substrates are bonded non-parallel to each other, there will be Apply high pressure locally to the substrate, thereby destroying the substrate
[0016] 3. The deformation of the vacuum processing chamber and the decrease of the accuracy of the substrate position
Position deviation of the holding board reduces the accuracy of the substrate bonding position
Method used
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no. 1 example
[0116] The first embodiment has the following advantages.
[0117](1) The pressure plate 33a and the platform 33b provided in the vacuum processing chamber 32 are opposed to each other. The pressure plate 33a is suspended from the second support plate 26 by the suspension rod 34 . The platform 33b is supported on the positioning platform 36 via the legs 37 . The upper container 32 a is suspended from the second support plate 26 through the upper bellows 35 . The lower container 32 b is supported on the positioning table 36 via the lower bellows 38 . The second support plate 26 and the positioning platform 36 are supported on the highly rigid bottom plate 21 and the door frame 22 . Even in the case where the vacuum processing chamber 32 is depressurized or deformed, the deformation is absorbed by the bellows 35 and 38 . Therefore, the influence of the deformation of the vacuum processing chamber 32 caused by the depressurization does not act on the pressure plate 33a and th...
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An apparatus for fabricating bonded substrates with fewer production defects. A press machine includes a vacuum process chamber formed by an upper container and a lower container, two holding plates for holding two substrates, and a pressing mechanism for moving upper holding plate downward. The upper container is connected to the pressing mechanism via upper bellows. The lower container is connected to a positioning stage via lower bellows. The upper and lower bellows prevent deformation of the vacuum process chamber from being transmitted to the two holding plates.
Description
[0001] This application is a divisional application of Invention Patent Application No. 03141056.1 filed on June 10, 2003, entitled "Method and Apparatus for Manufacturing Adhesive Substrates". technical field [0002] The present invention relates to methods and apparatus for manufacturing bonded substrates, and more particularly, to methods and apparatus for manufacturing panels such as liquid crystal displays (LCDs) by bonding two obtained from the substrate. Background technique [0003] Recently, there is a demand for devices that can manufacture large and thin flat display panels, such as liquid crystal display (LCD) panels, at high yields and at low cost. The LCD panel is manufactured by arranging two glass substrates facing each other at a very narrow interval (several micrometers), and filling liquid crystal between the two glass substrates. For example, the two glass substrates are an array substrate on which a plurality of TFTs (Thin Film Transistors) are formed ...
Claims
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IPC IPC(8): B32B37/00G02F1/1333
Inventor 村本孝纪大野琢也小松一茂桥诘幸司安立司宫岛良政中岛胜弘
Owner FUJITSU LTD