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Thermo compression bonding module and method for use thereof

A technology of thermocompression welding and welding force, which is applied in the field of thermocompression welding, and can solve problems such as chip damage and chip inability to be completely or correctly welded

Inactive Publication Date: 2007-02-07
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, at least some chips cannot be soldered completely or correctly
Also, at least some chips may be damaged during the bonding process due to overloading and applying too much pressure

Method used

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  • Thermo compression bonding module and method for use thereof
  • Thermo compression bonding module and method for use thereof
  • Thermo compression bonding module and method for use thereof

Examples

Experimental program
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Effect test

Embodiment Construction

[0012] figure 1 Isometric view of a thermocompression bonding workstation or system 8 having a plurality of thermocompression bonding modules 10 formed in accordance with an exemplary embodiment of the present invention. In an exemplary embodiment, thermocompression bonding station 8 is used to fabricate components (eg, flexible circuits like, for example, radio frequency identification ("RFID") tags or the like). However, the workstation 8 can also be used to manufacture other types of circuits or components. Workstation 8 represents one step in a series of manufacturing steps. Other fabrication steps may be performed prior to the bonding step, such as arranging circuits or components for the bonding step. Furthermore, other manufacturing steps can also be carried out after the bonding step, eg preparing the final finished product. Workstation 8 includes a set of thermocompression bonding modules 10 positioned in a matrix and used to manufacture multiple components simulta...

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PUM

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Abstract

The present application relates to a thermocompression bonding module (10) including a thermode assembly (12) configured to be mounted to a plate member (16). The thermode assembly (12) includes a heater assembly configured to apply a bonding force to an item during a bonding operation and a control device coupled to the heater assembly for adjusting the bonding force applied by the heater assembly to the item. A force feedback device is positioned, relative to the heater assembly (12) in order to detect the bonding force applied by the heater assembly (12). The control device adjusts the bonding force based on the bonding force detected by the force feedback device.

Description

technical field [0001] The present invention relates generally to thermocompression bonding, and more particularly, to apparatus and methods for thermocompression bonding. Background technique [0002] Machines and manufacturing processes for making various types of components, such as flexible circuits, are well known. An example of a flexible circuit is a radio frequency identification (RFID) tag. RFID tags can be made into labels and applied to high-volume products so that the products can be quickly and easily identified. Other types of flex circuits are manufactured in a similar way to RFID tags. [0003] Flexible circuits typically include a flexible substrate, such as Mylar. During the manufacturing process, an adhesive is spread on the substrate and a semiconductor chip is placed on the adhesive. The substrate and chip are transported to a bonding station, and the chip is bonded to the substrate. Often, multiple circuits can be fabricated at the same time. For ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K20/00B23K20/26H05K3/34
CPCH01L21/67132B23K20/023B23K2201/40B23K2101/40
Inventor 文森特·F·莱文尼尔彼得·J·博利萨克爱德华·J·埃森约翰·T·斯特克勒
Owner TE CONNECTIVITY CORP