AD converter and solid-state imaging device
an analog-to-digital converter and solid-state imaging technology, applied in the field of analog-to-digital (ad) converters and solid-state imaging devices, can solve problems such as circuit expansion and cost increas
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first embodiment
[0021]Embodiments of the disclosure are described in detail below with reference to FIG. 1 through. FIG. 10B.
Configuration of Solid-State Imaging Device
[0022]FIG. 1 is a block diagram illustrating the configuration of a solid-state imaging device 1 of a first embodiment of the disclosure.
[0023]The solid-state imaging device 1 of the first embodiment includes a pixel unit 10, a vertical scanning circuit 20, a horizontal scanning circuit 30, a clamp circuit 40, and an analog-to-digital (AD) converter 50.
[0024]The pixel unit 10 includes row and columns of pixels 12 that perform photoelectric conversion. The pixels 12 arranged in the same row direction are connected to the same wiring line 22, and thus connected to the vertical scanning circuit 20 to be controlled. The pixels 12 arranged in the same column direction are connected to the same pixel signal line 32. The pixel 12 photoelectrically converts incident light into an analog signal. The analog signal is transferred to the AD conv...
second embodiment
[0107]A second embodiment of the disclosure is described with reference to FIG. 11. A counter 58a of the second embodiment is different in configuration from the counter of the first embodiment.
[0108]FIG. 11 illustrates the counter 58a of the second embodiment. In accordance with the second embodiment, the outputs Q of DFF 74a1, DFF 74a2, DFF 74a3, DFF 74a4, . . . , DFF 74aN are respectively connected to second latch units 7921, 7922, 7923, 7924, . . . , 792N, and composite gates 721, 722, 723, 724, . . . , 72N. The configuration of the second embodiment operates in a way similar to the first embodiment.
third embodiment
[0109]A third embodiment of the disclosure is described with reference to FIG. 12 and FIG. 13A and FIG. 13B. For convenience of explanation, elements having functionalities identical to those of the first embodiment are designated with the same reference numerals and the discussion thereof is omitted herein.
Configuration of Solid-State Imaging Device
[0110]FIG. 12 is a block diagram illustrating the configuration of a solid-state imaging device 1b of the third embodiment.
[0111]In accordance with the third embodiment, a counter and latch unit 56b includes at high-order bits thereof a high-order bit counter 58b as a ripple counter, a high-order bit first latch unit 591b, and a high-order bit second latch unit 592b. The counter and latch unit 56b includes low-order bits thereof a low-order bit counter 80 as a gray code counter, a low-order bit first latch unit 821, and a low-order bit second latch unit 822.
[0112]Each high-order bit first latch unit 591a on each pixel column is connected...
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