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Electronic component cooling apparatus

a cooling apparatus and electronic component technology, applied in lighting and heating apparatus, semiconductor/solid-state device details, liquid fuel engines, etc., can solve the problem that the air-cooling heat sink cannot cool the electronic components to a sufficient degree, and achieve the effect of preventing degraded cooling efficiency

Inactive Publication Date: 2006-02-02
SANYO DENKI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0004] The prevent invention has been made to solve the problems described above. Accordingly, an object of the present invention is to provide an electronic component cooling apparatus that can cool electronic components generating a large amount of heat down to a sufficient level by means of so-called water-cooling.

Problems solved by technology

As an amount of heat generated by electronic components increases, however, a problem arises that simply air-cooling the heat sink cannot cool the electronic components down to a sufficient degree.

Method used

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Embodiment Construction

[0049] Now, by referring to the accompanying drawings, one embodiment of an electronic component cooling apparatus according to the present invention will be described in detail. FIG. 1 is a plan view showing a construction of embodiment of an electronic component cooling apparatus 1 according to the present invention. The electronic component cooling apparatus 1 has a water-cooled heat sink 3 having a coolant path therein, a radiator 7 cooled by a motor-driven fan 5, and a motor-driven pump 13 for giving a moving energy to the coolant in order to circulate the coolant between the heat sink 3 and the radiator 7.

[0050] The heat sink 3 has an electronic component mounting surface for mounting electronic components, such as a CPU, to be cooled. Also the heat sink 3 has a coolant path, with a coolant inlet (a cylindrical member 35) and a coolant outlet (a cylindrical member 36), through which a liquid coolant flows to forcibly cool the electronic component mounting surface. The radiato...

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PUM

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Abstract

An electronic component cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for giving a moving energy to the coolant. A plurality of engaging pieces of the motor-driven fan and a plurality of engaged portion of the radiator are engaged to connect the motor-driven fan and the radiator.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates to an electronic component cooling apparatus for forcibly cooling electronic components such as microcomputers and to a motor-driven pump and a radiator used in the electronic component cooling apparatus. [0002] Most of conventional electronic component cooling apparatuses, as disclosed in U.S. Pat. No. 5,519,574, have a combination of a heat sink having a plurality of radiation fins on a surface of a base plate and a motor-driven fan for forcibly cooling these fins and the surface of the base plate. [0003] As an amount of heat generated by electronic components increases, however, a problem arises that simply air-cooling the heat sink cannot cool the electronic components down to a sufficient degree. SUMMARY OF THE INVENTION [0004] The prevent invention has been made to solve the problems described above. Accordingly, an object of the present invention is to provide an electronic component cooling apparatus that can c...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/20F01P3/12F01P5/02F01P5/04F28D1/053H01L23/473H02K7/14H02K21/22
CPCF04D13/0673F04D29/588F28D1/05366F28D2021/0031H01L23/473H01L2924/0002F04D13/0633H01L2924/00
Inventor IIJIMA, MASAYUKIMIYAZAWA, MASASHIUENO, KOUJI
Owner SANYO DENKI CO LTD
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