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Manufacturing method of products attached with RFID label in a mold

a technology of radio frequency identification and mold, which is applied in the direction of mechanical vibration separation, thin material processing, coatings, etc., can solve the problems of increasing manufacturing processes, reducing effectiveness, and enhancing cos

Inactive Publication Date: 2008-08-28
HUANG SHENG CHANG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]This invention has been devised to offer a manufacturing method of products attached with an RFID label in a mold, for protecting the RFID label from broken or worn out so as to keep intact the identifying capacity of the RFID.

Problems solved by technology

However, the conventional radio frequency identification system has a flow that it cannot be applied to a wide variety, in other words, it is extremely limited in its applicable scope, with every circuit board necessary to be adhered on with an adhesive layer, so it is not convenient for mass production, increasing manufacturing processes, lowering effectiveness and enhancing its cost.

Method used

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  • Manufacturing method of products attached with RFID label in a mold
  • Manufacturing method of products attached with RFID label in a mold
  • Manufacturing method of products attached with RFID label in a mold

Examples

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Embodiment Construction

[0028]A first preferred embodiment of a manufacturing method of products formed in a mold and attached with a RFID label during molding process in the present invention, as shown in FIG. 1, includes a first step, a second step, and a third step.

[0029]The first step is to prepare a first mold 1 for forming a substratum 10 by means of injecting molding, pushing molding, vacuum molding, pressing molding or sword molding, and the substratum may be made of the same as or a different material from that of plastic products, as a thin film, a thin plate, a foamed thin sheet, or a compound thin plate having a thickness 0.1-1.0 mm according to the necessity of a product, but it may be thinner than 0.1 mm or thicker than 1.0 mm, if necessary.

[0030]The second step is to attach a RFID label 2 on a product being made in a mold, and the RFID label 2 is an electronic circuit board 20 with a radio frequency identification chip and an antenna arranged thereon, which preferably has a thickness 0.05-0....

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Abstract

A manufacturing method of products attached with a RFID label in a mold includes a first step of forming a thin substratum by injecting molding, pushing molding, vacuum molding, blowing molding or sword molding in a first mold, a second step of making a substratum label composed of the substratum and an RFID label adhered with the substratum, and a third step of placing the substratum label in a second mold, in which a plastic product is to be formed and also to be attached with the substratum label inside the product during molding process. Thus, protected by the substratum and the plastic product. The RFID cannot be broken or damaged to always maintain its capacity to be identified, with the plastic product enhanced in its value.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]This invention relates to a manufacturing method of products attached with an RFID (radio frequency identification device) in a mold, particularly to one having several steps for making a product attached with a substratum label consisting of a substratum and a radio frequency identification device during forming the plastic product in a mold. Then the RFID combined with the label is positioned between the substratum and the plastic product so that the RFID is protected from unnecessarily broken or damaged, with its identifying capacity possible to be always maintained intact.[0003]2. Description of the Prior Art[0004]Nowadays radio frequency identification has widely been used on various goods, in order to escalate the speed of circulation, identification, and filing. At present the chips used for radio frequency identification always have an adhesive film layer glued on the electronic circuit of the chip, and then the...

Claims

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Application Information

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IPC IPC(8): B32B3/10
CPCB29C45/14811B29C45/162B29C45/1671B29C49/00B29C51/00Y10T428/239B29C2045/14918B29C2045/1673B29K2715/006B29K2995/002B29C2045/14852
Inventor HUANG, SHENG-CHANG
Owner HUANG SHENG CHANG