Lead-free cationic electrodeposition coating composition, and electrodeposition coating process
a technology of cationic electrodeposition and coating composition, which is applied in the direction of electrolytic coatings, coatings, paints for electrolytic applications, etc., can solve the problems of difficult to sufficiently increase the deposition property of binder resin, difficult to deposit coating solids on the substrate, etc., and achieve high throwing power, reduce and increase film resistance of coated films
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example a
Preparation Example A1
Preparation of Amine-Modified Epoxy Resin
[0079]92 parts of 2,4- / 2,6-tolylenediisocyanate (weight ratio=8 / 2), 95 parts of methyl isobutyl ketone (hereinafter, referred to as MIBK) and 0.5 part of dibutyltin dilaurate were loaded to a flask equipped with a stirrer, a cooling tube, a nitrogen introducing tube, a thermometer and a dropping funnel. 21 parts of methanol was added while stirring the mixture.
[0080]Starting at room temperature, the reaction mixture was allowed to rise to 60° C. by exothermic, the reaction was retained for 30 minutes, and 57 parts of ethylene glycol mono-2-ethylhexyl ether was dropped from the dropping funnel. Furthermore, 42 parts of bisphenol A-propylene oxide 5 mol adduct was added. The reaction was carried out mainly in the temperature range of 60 to 65° C., and continued until absorption based on an isocyanate group disappeared in IR spectrum measurement.
[0081]Next, 365 parts of bisphenol A type epoxy resin of epoxy equivalent 188 s...
preparation example a2
Preparation of Amine-Modified Epoxy Resin
[0083]An amine-modified epoxy resin having a glass transition temperature of 15° C. (solid content: 80%, number average molecular weight: 1640) was prepared according to the same manner as described in Preparation example A1 except that 74 parts of bisphenol A and 17 parts of octylic acid was employed.
preparation example a3
Preparation of Amine-Modified Epoxy Resin
[0084]An amine-modified epoxy resin having a glass transition temperature of 22° C. (solid content: 80%, number average molecular weight: 1810) was prepared according to the same manner as described in Preparation example A1 except that 87 parts of bisphenol A and no octylic acid was employed.
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Abstract
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