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Printed circuit board having metal bumps

a printed circuit board and bump technology, applied in the field of metal bumps on printed circuit boards, can solve the problems of increasing manufacturing costs, difficult to realize bumps arranged at pitches of 120 m or less, and printing technology use of bumps to form bumps

Inactive Publication Date: 2012-03-15
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this regard, as the number of I / Os is increased above a certain number, the flip chip process is preferably used because of an increase in the manufacturing costs.
However, the above-described conventional process of forming bumps of a printed circuit board using a printing technique is disadvantageous in that it is hard to realize bumps arranged at pitches of 120 μm or less.
Accordingly, when bumps are formed at fine pitches using the printing technique, the bumps are abnormally shaped.
Furthermore, even if the bumps are normally shaped, the volume of the bumps is excessively decreased.

Method used

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  • Printed circuit board having metal bumps
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  • Printed circuit board having metal bumps

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Embodiment Construction

[0039]Various objects, advantages and features of the invention will become apparent from the following description of embodiments with reference to the accompanying drawings.

[0040]The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe most appropriately the best method he or she knows for carrying out the invention.

[0041]Hereinafter, a printed circuit board having round solder bumps according to the present invention will be described in greater detail with reference to the accompanying drawings. Throughout the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions thereof are omitted. I...

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PUM

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Abstract

A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a U.S. divisional application filed under 37 CFR 1.53(b) claiming priority benefit of U.S. Ser. No. 12 / 379,684 filed in the United States on Feb. 26, 2009, which claims earlier priority benefit to Korean Patent Application No. 10-2008-0119895 filed with the Korean Intellectual Property Office on Nov. 28, 2008 the disclosures of which are incorporated herein by reference.BACKGROUND[0002]1. Field[0003]The present invention relates to a printed circuit board having metal bumps and a method of manufacturing the same, and more particularly to a printed circuit board having metal bumps which have even heights and make direct connections with a circuit pattern without using additional bump pads thus allowing the arrangement thereof at fine pitches, and a method of manufacturing the same.[0004]2. Description of the Related Art[0005]With the recent advancement of the electronics industry, electronic components are being develop...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/09H05K1/11H05K1/02
CPCH05K1/111H05K3/205H05K3/28H05K3/4007H05K2201/0367H05K2203/0323Y10T29/49155H05K1/09H05K1/115Y10T29/49222Y10T29/49147Y10T29/49204Y10T29/49124H05K2203/0376Y02P70/50H05K3/40
Inventor KANG, MYUNG SAMPARK, JEONG WOOKIM, OK TAEYUN, KIL YONG
Owner SAMSUNG ELECTRO MECHANICS CO LTD