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Handler having position correcting function and method of loading uninspected device into measuring socket

a technology of position correction and handler, which is applied in the direction of individual semiconductor device testing, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problems of reducing the size and weight of various devices, affecting the posture of devices, and affecting the accuracy of measurement results

Inactive Publication Date: 2013-08-13
TOHOKU SEIKI IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, various devices are becoming more and more downsized and made thin and light.
However, even by the means described above, a series of steps of holding, conveying, loading into a socket, pushing and accommodating can not be accomplished correspondingly to various types of devices.
When this method is employed, even if positioning is accurately made with great effort, there is a fear that the posture of the device may collapse.
In the system in which the sucking, socket loading nozzle and the measuring clamper are separated from each other and after a robot loads the device into the IC socket, the device is pushed by the measuring clamper which is a different unit, it is difficult to provide sufficiently high processing capacity.

Method used

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  • Handler having position correcting function and method of loading uninspected device into measuring socket
  • Handler having position correcting function and method of loading uninspected device into measuring socket
  • Handler having position correcting function and method of loading uninspected device into measuring socket

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Embodiment Construction

[0044]FIG. 1 is a plan view entirely showing an example of the handler 10 of the present invention. In the same manner as that of the handler shown in FIG. 15, this handler 10 is a horizontal type automatic handler. On the machine casing table A, areas are laid out as follows.

[0045]In the drawing, on the machine casing table A, the lowermost stage is a stacker area Sa for the trays. The intermediate stage is a positioning area Sma for positioning each tray. The upper stage portion is an image recognizing area Ira and the uppermost stage portion is a measuring area Ma.

[0046]The uninspection tray stacker 11, the accommodation tray stacker 12, 12, the empty tray buffer 13 for an uninspection tray and the empty tray buffer 14 for tray accommodation are arranged in the stacker area Sa in the lowermost stage.

[0047]In this connection, although not shown in the drawing, these trays can accommodate and hold a predetermined number of devices. The stacker of each tray can accommodate a tray of...

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PUM

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Abstract

A handler includes a device holding portion, which holds an uninspected device and loads the device in a measuring socket on a device tester, having a suction means for sucking the device by a very weak pushing force at the time of sucking the device from an uninspection tray and for loading the device in a measuring socket and also having a clamper capable of outputting a pushing force which can be changed at the time of the measurement contact. The device holding portion includes a position correcting mechanism for making a device position correction executed by an image recognizing and position correcting means.

Description

TECHNICAL FIELD[0001]The present invention relates to a handler used when measuring and inspecting electronic parts, which will be referred to as a device hereinafter, together with an electronic part inspecting device. More particularly, the present invention relates to a horizontal-type handler.BACKGROUND ART[0002]Recently, electronic equipment has made rapid progress and various devices are mounted on electronic equipment and devices has been downsized. Therefore, the devices can be mounted on electronic equipment at high density. Accordingly, many packages are mounted on a surface of the electronic equipment.[0003]Examples of the devices described above are CSP (Chip Size Package), BGA (Ball Grid Array) and QFP (Quad Flat Package). That is, the devices are made thinner and lighter. Further, the intervals of the pins incorporated into the devices are arranged at short intervals and the number of pins has increased.[0004]Concerning the devices described above, in order for the ele...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): B65H1/16B65H5/08
CPCG01R31/2893G01R31/2891G01R31/26H01L22/00
Inventor YOKOO, MASAYOSHIYOSHIDA, KOICHIKAINUMA, NORIKAZU
Owner TOHOKU SEIKI IND