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Solid-state imaging element and camera system

a technology of solid-state imaging and camera system, which is applied in the scanning details of television systems, picture signal generators, television systems, etc., can solve the problems of varying saturation value and breakpoint position, and achieve the effect of wide dynamic range and high sensitivity

Active Publication Date: 2013-09-03
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This approach enables a wide dynamic range imaging system with high sensitivity at low light levels and reduced sensitivity at high light levels, minimizing saturation and enhancing signal-to-noise ratio, while eliminating the need for external memory and maintaining high resolution without increased processing complexity.

Problems solved by technology

However, in the case of the above-described divided-pixel addition, an invalid region (dead space) that does not directly contribute to photo-sensing exists in terms of signal processing differently from a pixel having the area equal to the total of the areas of the divided pixels.
This causes e.g. a problem that the saturation value varies and the breakpoint position also varies.

Method used

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  • Solid-state imaging element and camera system
  • Solid-state imaging element and camera system
  • Solid-state imaging element and camera system

Examples

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Embodiment Construction

[0053]An embodiment of the present invention will be described below in association with the drawings.

[0054]FIG. 1 is a block diagram showing a configuration example of a solid-state imaging element (CMOS image sensor) including column parallel ADCs according to the embodiment of the present invention.

[0055]The embodiment of the present invention can be applied not only to the CMOS image sensor but also to a CCD. The following description will be made by taking the CMOS image sensor as one example.

[0056]As shown in FIG. 1, this solid-state imaging element 100 has a pixel unit 110, a vertical scan circuit 120, a horizontal transfer scan circuit 130, a timing control circuit 140, and an analog-digital converter (ADC) group 150.

[0057]The solid-state imaging element 100 further has a digital-analog converter (DAC) 160, amplifier circuits (S / A) 170, a signal processing circuit 180, and a horizontal transfer line 190.

[0058]The pixel signal readout unit is formed by the vertical scan circu...

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Abstract

Disclosed herein is a solid-state imaging element including a pixel unit configured to include a plurality of pixels arranged in a matrix and a pixel signal readout unit configured to include an analog-digital conversion unit that carries out analog-digital conversion of a pixel signal read out from the pixel unit. Each one of the pixels in the pixel unit includes a plurality of divided pixels arising from division into regions different from each other in optical sensitivity or a charge accumulation amount. The pixel signal readout unit reads out divided-pixel signals of the divided pixels in the pixel. The analog-digital conversion unit carries out analog-digital conversion of the divided-pixel signals that are read out and adds the divided-pixel signals to each other to obtain a pixel signal of one pixel.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a solid-state imaging element typified by a CCD and a CMOS image sensor, and a camera system.[0003]2. Description of the Related Art[0004]It is desired to realize a wide dynamic range solid-state imaging element by which even details can be so imaged that high-luminance information does not collapse and low-luminance part of the subject image does not become too black even in photographing against light such as light of car headlights, illumination light of a ball game ground, or sunlight.[0005]Under such circumstances, regarding a solid-state imaging element such as a CCD, techniques for enlarging the dynamic range are disclosed in e.g. Japanese Patent No. 2125710, Japanese Patent Laid-Open No. Hei 3-117281, Japanese Patent Laid-Open No. Hei 9-205589, and Japanese Patent Laid-Open No. 2004-320119 (Hereinafter, Patent Document 1, Patent Document 2, Patent Document 3, and Patent Document ...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H04N5/335H04N23/12H04N25/00H04N25/46
CPCH04N5/35545H04N5/378H04N5/37457H01L27/14627H01L27/14643H04N25/581H04N25/778H04N25/78H04N25/75
Inventor UI, HIROKI
Owner SONY CORP
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