The application provides a packaging carrier and a
machine, which comprises a carrier plate, a pressing plate and a plurality of lifting pads; the carrier plate is used for carrying a substrate, the upper surface of the carrier plate is provided with a first groove, and the first groove is used for providing a deformation space for the substrate; the pressing plate is located on the upper surface of the substrate and exposes the upper surface of the part of the substrate which is in contact with a
chip, and is used for providing a downward pressure to the substrate; the plurality of lifting pads are arranged in an array in the first groove, the lifting pads are movable in the vertical direction, the upper surface of the lifting pads is lower than the upper surface of the carrier plate when the lifting pads are moved to a
lower limit position, and the upper surface of the lifting pads is higher than the upper surface of the carrier plate when the lifting pads are moved to an upper limit position. The packaging carrier of the application has a wide range of applications, and the warping conditions of the substrate and the
chip can be made consistent by adjusting the height of the lifting pads, the adjustment is flexible, the packaging carrier is not customized, the work efficiency is greatly improved, and the production cost is reduced.