Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

4results about How to "Avoid customization" patented technology

Die steel casting and forging piece with replaceable die core

ActiveCN224273147UImprove changeover efficiency and production stabilityeasy to operateForging/hammering/pressing machinesScrew threadThreaded rod
The utility model relates to the technical field of die steel casting and forging pieces, and discloses a die steel casting and forging piece with a replaceable die core, which comprises a die shell, a lifting plate is slidably connected to the inner wall of the die shell, a pull rod is slidably connected to the inner wall of the lifting plate, and die core bodies are connected to the two sides of the outer wall of the pull rod through buckle assemblies. And rotary knobs are rotationally connected to the left side and the right side of the inner wall of the lifting plate correspondingly, and the inward ends of the rotary knobs are connected with the mold shell through caliper assemblies correspondingly so as to be used for adjusting the height of the lifting plate. According to the utility model, by rotating the threaded rod I and pulling the pull rod outwards, the limitation on the mold core body can be relieved, and the mold core body can be taken down, so that the operation is simple, the structure is simple, the mold remodeling efficiency and the production stability are greatly improved, the downtime of equipment is reduced, the production time cost is saved, and the molding quality and the yield of products are improved.
Owner:YIXING DINGLI MOULD MFG CO LTD

An adjustable packaging wooden box

ActiveCN224428391Ureduce typesReduce inventory costsInventory costWooden box
This utility model discloses an adjustable packaging wooden box, belonging to the technical field of packaging wooden boxes. It includes a box body for packaging, with two double-circular limiting grooves on the top of the box body to restrict sliding. Two springs are symmetrically connected inside each of the two double-circular limiting grooves. Each of the four springs has a double-circular slider connected to its end. Damping is provided between the four springs and the double-circular limiting grooves. The four double-circular sliders are slidably disposed inside the double-circular limiting grooves. Six guide posts for limiting positioning are welded inside the double-circular limiting grooves, completely penetrating the double-circular sliders. Connecting blocks for connection are welded to the bottom of each double-circular slider. This adjustable packaging wooden box increases adjustability, can adapt to goods of different sizes, avoids the need to customize new wooden boxes due to changes in goods specifications, and reduces the variety of wooden boxes and inventory costs.
Owner:ZHENGZHOU SENYI PACKAGING CO LTD

Packaging carrier and machine

ActiveCN224419227UImprove warpageAdaptation to warpage conditionsMechanical engineeringPhysics
The application provides a packaging carrier and a machine, which comprises a carrier plate, a pressing plate and a plurality of lifting pads; the carrier plate is used for carrying a substrate, the upper surface of the carrier plate is provided with a first groove, and the first groove is used for providing a deformation space for the substrate; the pressing plate is located on the upper surface of the substrate and exposes the upper surface of the part of the substrate which is in contact with a chip, and is used for providing a downward pressure to the substrate; the plurality of lifting pads are arranged in an array in the first groove, the lifting pads are movable in the vertical direction, the upper surface of the lifting pads is lower than the upper surface of the carrier plate when the lifting pads are moved to a lower limit position, and the upper surface of the lifting pads is higher than the upper surface of the carrier plate when the lifting pads are moved to an upper limit position. The packaging carrier of the application has a wide range of applications, and the warping conditions of the substrate and the chip can be made consistent by adjusting the height of the lifting pads, the adjustment is flexible, the packaging carrier is not customized, the work efficiency is greatly improved, and the production cost is reduced.
Owner:SJ SEMICONDUCTOR (JIANGYIN) CORP