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10results about How to "Increase cooling space" patented technology

Ventilated partition

The application relates to the field of batteries, and particularly discloses a ventilation partition plate which is configured as an even number of sub-air ducts for guiding cooling airflow to flow; the sub-air ducts at least comprise a first configuration surface, a second configuration surface and a third configuration surface; the second configuration surface and the third configuration surface are respectively adjacent to the first configuration surface; at least one group of adjacent sub-air ducts is provided with a mixed-air opening; the ventilation partition plate has improved heat dissipation efficiency through the curved surface capable of generating the Coanda effect.
Owner:ZHEJIANG BOSHI NEW ENERGY TECH CO LTD

Double-layer battery pack capable of rapidly dissipating heat and control method of double-layer battery pack

PendingCN121906024AAvoid winding short circuitsSolve the problem of uneven heat dissipation inside and outsideCell temperature controlCell component detailsElectrical batteryMechanical engineering
The invention discloses a rapid heat dissipation double-layer battery pack and a control method thereof.The rapid heat dissipation double-layer battery pack comprises a double-layer protective shell, a plurality of battery cells are evenly distributed on orientation rotating assemblies, and synchronous driving gear assemblies used for driving the orientation rotating assemblies to rotate synchronously are arranged among the orientation rotating assemblies; the plurality of battery cells on the orientation rotating assembly and the plurality of battery cells on the adjacent orientation rotating assembly are arranged in a staggered and meshed manner in the rotating process, so that compact layout is realized; the inner wall of the protective shell is provided with an air-cooling heat dissipation assembly for blowing and heating the plurality of battery cells positioned on the outer side; the problems that heat dissipation of inner and outer side battery cores of an existing double-layer battery pack is unbalanced, compact layout contradicts with heat dissipation efficiency, heat dissipation response lags behind in a high-temperature scene, and transmission and heat dissipation channels are prone to being interrupted after layering separation are solved, self-adaptive balanced heat dissipation is achieved, the working stability and safety of the battery pack are improved, and the service life of the battery pack is prolonged.
Owner:ZHONGSHAN OULI IND CO LTD

Information processing apparatus

The application discloses an information processing device, which comprises a body, a display screen rotatably connected to the body, the body comprises an upper shell and a lower shell connected below the upper shell, one or more heat dissipation air outlets are formed between the upper shell and the lower shell, a movable shell is installed on the heat dissipation air outlet, a driving unit is arranged in the body, when the display screen is rotated to open, the driving unit drives the movable shell to open to expose the heat dissipation air outlet, when the display screen is rotated to close, the driving unit drives the movable shell to close to close the heat dissipation air outlet. Due to the above technical means, the application improves the heat dissipation structure of the notebook computer, the air outlet which can be opened and closed is arranged on the body, when the notebook computer is opened and used, the air outlet is opened to expand the heat dissipation space, so that the heat generated during the use of the notebook computer can be timely output.
Owner:SAMSUNG ELECTRONICS SUZHOU COMP +1

Protective assembly, front floor assembly, and vehicle

ActiveCN224409135UImprove space utilizationIncrease cooling spaceMechanical engineeringAmplifier
The utility model discloses a protection assembly, front floor assembly and vehicle. The protection assembly, including protection heat dissipation board, protection heat dissipation board includes first board body, second board body and third board body. The first board body includes the first side portion, and the second side portion is spaced apart with the first side portion along the length direction of protection heat dissipation board and is fixedly connected with the first connecting portion of front floor. Along the thickness direction of front floor, the second side portion is set in the upper side of first side portion. The first connecting portion is set between the first side portion and the second side portion. One side of second board body is fixedly connected with the second side portion, so that the first board body and second board body cooperate and form heat dissipation space. The other side of second board body is fixedly connected with third board body, and the second connecting portion of third board body is fixedly connected with front wallboard. The protection assembly can effectively improve the heat dissipation effect of power amplifier, and is favorable to improve the stability of long-time playing of vehicle sound.
Owner:ZHEJIANG ZEEKR INTELLIGENT TECH CO LTD +2

XRF spectrometer

The invention provides an XRF spectrometer, and relates to the technical field of spectrometers. The invention relates to a portable electronic device which comprises a machine shell, a machine core, a separation type handle and a first battery, the machine core is arranged in the machine shell, a heat dissipation structure used for conducting heat dissipation on the interior of the machine shell is arranged on the machine shell, the separation type handle is detachably connected with the machine shell, and the first battery is arranged in the separation type handle and electrically connected with the machine core. By means of the innovative split type structural design, the machine shell and the split type handle are detachably connected, rapid replacement or upgrading of core components is easier, the instrument is more convenient to maintain and upgrade due to the modular design form, and the environmental adaptability and maintainability are improved. Different machine cores can be used in cooperation with the same separated handle all the time, and the development cost of follow-up instruments is effectively reduced. The heat dissipation structure further increases the heat dissipation area, improves the heat dissipation performance of the instrument, facilitates the reduction of the temperature environment in the housing, and reduces the overall power consumption.
Owner:SHENZHEN LAI RAY TECH DEV CO LTD

Hydrogen production power supply cabinet

ActiveCN224288950Usave horizontal spacesave lengthCellsBus-bar/wiring layoutsBusbarProcess engineering
The utility model relates to a hydrogen production power supply cabinet, comprising a common unit cabinet which is suitable for arranging an output busbar; and a plurality of conversion unit cabinets, wherein the interior of each conversion unit cabinet is suitable for being provided with a power conversion module. The plurality of conversion unit cabinets are adjacently arranged on at least one transverse side of the common unit cabinet with the common unit cabinet, and comprise at least two conversion unit cabinets which are longitudinally arranged on the same transverse side of the common unit cabinet; and the output busbar only extends in the common unit cabinet along the transverse direction and is connected with the power conversion module in each conversion unit cabinet. Compared with a structure in which unit cabinets are arranged in a row in the prior art, the hydrogen production power supply cabinet has the advantages that the transverse space of the whole hydrogen production power supply cabinet can be greatly reduced, the output busbar can be only arranged in the shared unit cabinet, the length and the use amount of the output busbar are saved, and the heat dissipation efficiency and the heat dissipation cost of the output busbar are improved.
Owner:ABB BEIJING DRIVE SYST CO LTD

Heat sink structure and semiconductor package incorporating heat sink

PendingCN122662668Aefficient releaseIncrease cooling space
The present invention relates to a heat sink structure and a semiconductor package incorporating the same. The heat sink structure according to an embodiment of the present invention includes two or more heat sinks that transfer heat by contacting a first surface and a second surface of a semiconductor package, each of the heat sinks including a first heat radiating portion having a first area contacting one surface of the semiconductor package and having a flat surface, a third area formed on an opposite surface of the first area in a length corresponding to the first area, and a second heat radiating portion having a second area extending from the first area in a lengthwise direction of the semiconductor package, a fourth area formed on an opposite surface of the second area in a length corresponding to the second area, and a plurality of heat radiating fins can be formed in the second to fourth areas, respectively, so as to increase a surface area contacting cooling air.
Owner:JMJ KOREA CO LTD

A solar panel mount

ActiveCN224596398UEasy to fixFlexible adaptation to fixedness
This utility model discloses a solar panel bracket, including a fixing frame and a locking member. The fixing frame includes a first fixing frame and a second fixing frame; the first fixing frame and the second fixing frame are rotatably connected, and the rotation stroke includes at least reciprocating rotation from a collinear position to a perpendicular position. The first fixing frame and the second fixing frame are detachably connected to the outer periphery of the solar panel or the fixing frame of the solar panel at the top or side. The locking member is provided with a first connecting part and a second connecting part at intervals along the length direction; the first connecting part is connected to the first fixing frame and is limited to cooperate with the first fixing frame in the rotation plane; the second connecting part is connected to the second fixing frame and is limited to cooperate with the second fixing frame in the rotation plane. When the first connecting part and the second connecting part are fixed at a first interval, the first fixing frame and the second fixing frame are perpendicular to each other; when the first connecting part and the second connecting part are fixed at a second interval, the first fixing frame and the second fixing frame are collinear.
Owner:XIAMEN DONESTY ECOMMERCE CO LTD

Chip heat dissipation packaging structure convenient for heat dissipation

PendingCN121889015AAccelerate convection and dispersionSolve the problem of insufficient cooling spaceThermodynamicsMechanical engineering
The invention belongs to the technical field of chip packaging, and particularly relates to a chip heat dissipation packaging structure convenient for heat dissipation, which comprises a packaging shell, a packaging substrate, chips, a positioning plate and a packaging cover plate, the packaging substrate is fixed in the packaging shell, the chips are respectively arranged on the packaging substrate and the positioning plate, and the positioning plate is arranged between the packaging substrate and the packaging cover plate. A limiting boss is arranged on the inner side of the packaging shell, the bottom of the packaging substrate is fixed to the limiting boss, and a heat dissipation channel is formed by the packaging substrate and the packaging shell through the limiting boss. A heat dissipation channel is formed between the bottom of the packaging substrate and the packaging shell, space is provided for air circulation, and convection and dissipation of heat are accelerated; and meanwhile, a plurality of uniformly distributed heat dissipation holes are formed in the mounting groove of the packaging substrate, a plurality of uniformly distributed heat dissipation grooves are formed in the positioning plate body, and the heat dissipation holes are matched with the heat dissipation grooves, so that the heat dissipation paths are greatly enriched, the heat dissipation efficiency is improved, and the problem of insufficient heat dissipation space of a traditional structure is effectively solved.
Owner:HONGZHAN SCIENCE & TECHNOLOGY (SHENZHEN) TECHNOLOGY CO LTD