The invention belongs to the technical field of
chip packaging, and particularly relates to a
chip heat dissipation packaging structure convenient for heat dissipation, which comprises a packaging shell, a packaging substrate, chips, a positioning plate and a packaging cover plate, the packaging substrate is fixed in the packaging shell, the chips are respectively arranged on the packaging substrate and the positioning plate, and the positioning plate is arranged between the packaging substrate and the packaging cover plate. A limiting boss is arranged on the inner side of the packaging shell, the bottom of the packaging substrate is fixed to the limiting boss, and a heat dissipation channel is formed by the packaging substrate and the packaging shell through the limiting boss. A heat dissipation channel is formed between the bottom of the packaging substrate and the packaging shell, space is provided for air circulation, and
convection and dissipation of heat are accelerated; and meanwhile, a plurality of uniformly distributed heat dissipation holes are formed in the mounting groove of the packaging substrate, a plurality of uniformly distributed heat dissipation grooves are formed in the positioning plate body, and the heat dissipation holes are matched with the heat dissipation grooves, so that the heat dissipation paths are greatly enriched, the heat dissipation efficiency is improved, and the problem of insufficient heat dissipation space of a traditional structure is effectively solved.