2results about How to "Relief space" patented technology

The invention discloses a plastic bearing bucket in the technical field of plastic bearing buckets, which comprises a bucket body and a receding bin arranged at the top of the bucket body and capable of communicating with the bucket body; the injection opening is located in the top of the barrel body and is coaxial with the receding bin, and the inner wall of the top of the injection opening can be in threaded connection with a sealing cover; the partition plate is arranged between the receding bin and the injection opening in a sealed mode and elastically slides relative to the receding bin through an elastic telescopic piece. The partition plate can divide the receding bin into a receding cavity communicating with the outside and a fusion cavity fused with the barrel body. The limiting frame is fixedly arranged between the barrel body and the injection opening and used for limiting the lower limit of movement of the partition plate; and the exhaust groove is formed in the top of the receding bin and used for air intake and exhaust of the receding cavity, the partition plate ascends and descends in the additionally-arranged receding bin, the size of the fusion cavity is adjusted, the variable of the storage space caused by deformation of the barrel body is balanced, and the situation that the sealing effect of the sealing cover is affected due to internal pressure increase caused by compression deformation of the barrel body is avoided.

This application discloses a power supply system and a server. The power supply system employs at least two power supply components, each including a power supply group and a power supply backplane. The power supply group is located on one side of the power supply backplane and distributes power to the compute nodes and switching nodes via the power supply backplane. The switching nodes are arranged among multiple power supply groups and form positive interconnections with the compute nodes. By distributing power supply capabilities and combining them with the backplane power supply structure, the power supply expansion capability of high-density systems can be improved, the adaptability of the power supply structure to node spatial layout, heat dissipation, and cabling channels can be improved, the impact of centralized power distribution can be reduced, and the system reliability and maintenance convenience can be improved, thereby enhancing the performance of the power supply system.