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Positioning method for detecting flip-chip substrate

A positioning method and substrate technology, which are used in electronic circuit testing, non-contact circuit testing, semiconductor/solid-state device testing/measurement, etc., and can solve the problems of inability to meet the extremely precise requirements of flip chip substrates and incorrect test results.

Inactive Publication Date: 2007-12-05
CONTREL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Before testing the flip-chip substrate with a testing machine, the flip-chip substrate must be positioned at the position to be tested, and because the contact density on the flip-chip substrate is extremely high, the distance between the contacts is extremely small, and a slight gap will cause Inaccurate detection results, traditional positioning methods, such as using flip-chip substrate edge positioning, can no longer meet the extremely precise requirements of flip-chip substrates

Method used

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  • Positioning method for detecting flip-chip substrate
  • Positioning method for detecting flip-chip substrate
  • Positioning method for detecting flip-chip substrate

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Embodiment Construction

[0020] In order to describe the features of the present invention in detail, the following preferred embodiment is given and described in conjunction with the accompanying drawings as follows:

[0021] Please refer to FIG. 1 to FIG. 4 , a positioning method for inspecting flip-chip substrates provided by a preferred embodiment of the present invention mainly includes the following steps:

[0022] A. Provide a detection device (11), with an upper detection head (12), a lower detection head (14), a seat (16), and a camera (18), the upper detection head (12) and the lower detection head (14) The detection head (14) can be displaced in the X-axis direction, the Y-axis direction, and the Z-axis direction, and can be rotated horizontally at an angle of θ, and the two detection heads (12) (14) have probes (the structure of the probes is It is well known and not the focus of the application of the present invention, and will not be described in detail); the seat (16) is used to receiv...

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Abstract

The invention relates to an orientation method of detecting cladding crystal basic plate, which comprises the following steps: A. providing a detecting device with an up-test end, a down-test end, a holder and a camera; B. setting a datum position which can be recorded by camera marking the present plate with double orientation mark separately; C. setting the present plate position: viewfinding the present double orientation mark by camera; D. comparing the present plate mark with the double datum orientation mark as the position misdistance; E. displacing or revolving the position misdistance to finish orientating by compensating error.

Description

technical field [0001] The present invention is related to the positioning technology of the detected element, in detail, it refers to a positioning method for detecting flip-chip substrates. Background technique [0002] Press, flip chip substrate is a circuit board with small size and high-density contacts and circuits, which has the advantages of small size, high pin count, good electrical characteristics, etc. Before installing the flip-chip substrate, it is necessary to test the flip-chip substrate, so as to avoid the loss of die caused by the defects of the flip-chip substrate itself. [0003] Before testing the flip-chip substrate with a testing machine, the flip-chip substrate must be positioned at the position to be tested, and because the contact density on the flip-chip substrate is extremely high, the distance between the contacts is extremely small, and a slight gap will cause The detection results are incorrect, and the traditional positioning methods, such as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/304G01R31/28H01L21/66
Inventor 陈金圣陈逸平陈志明
Owner CONTREL TECH CO LTD