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Positioning method for detecting flip-chip substrate

A positioning method and substrate technology, which are used in electronic circuit testing, non-contact circuit testing, semiconductor/solid-state device testing/measurement, etc., and can solve problems such as incorrect test results and inability to meet the extremely precise requirements of flip chip substrates.

Inactive Publication Date: 2006-02-15
CONTREL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Before testing the flip-chip substrate with a testing machine, the flip-chip substrate must be positioned at the position to be tested, and because the contact density on the flip-chip substrate is extremely high, the distance between the contacts is extremely small, and a slight gap will cause Inaccurate detection results, traditional positioning methods, such as using flip-chip substrate edge positioning, can no longer meet the extremely precise requirements of flip-chip substrates

Method used

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  • Positioning method for detecting flip-chip substrate
  • Positioning method for detecting flip-chip substrate
  • Positioning method for detecting flip-chip substrate

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Embodiment Construction

[0020] In order to explain the features of the present invention in detail, a preferred embodiment is given below and is described in conjunction with the accompanying drawings as follows:

[0021] See Figure 1 to Figure 4 A preferred embodiment of the present invention provides a positioning method for detecting a flip chip substrate, which mainly includes the following steps:

[0022] A. Provide a testing device (11), with an upper testing head (12), a lower testing head (14), a bearing (16), and a camera (18), the upper testing head (12) and the lower The detection head (14) can be displaced in the X-axis direction, Y-axis direction, and Z-axis direction, and can be rotated horizontally by an angle of θ, and the two detection heads (12) and (14) have probes (the probe structure is It is well known and is not the focus of the application of the present invention, so it will not be repeated); the socket (16) is used to support the flip chip substrate (22) and can be displaced bet...

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Abstract

The invention relates to an orientation method of detecting cladding crystal basic plate, which comprises the following steps: A. providing a detecting device with an up-test end, a down-test end, a holder and a camera; B. setting a datum position which can be recorded by camera marking the present plate with double orientation mark separately; C. setting the present plate position: viewfinding the present double orientation mark by camera; D. comparing the present plate mark with the double datum orientation mark as the position misdistance; E. displacing or revolving the position misdistance to finish orientating by compensating error.

Description

Technical field [0001] The present invention is related to the positioning technology of the detected component, and in detail, refers to a positioning method for detecting a flip chip substrate. Background technique [0002] Flip chip substrate is a circuit board with small size and high density of contacts and circuits. It has the advantages of small size, high pin count, and good electrical characteristics. However, when bonding the die to the cover Before the chip substrate, it is necessary to test the flip chip substrate, so as to avoid the loss of die due to the defects of the flip chip substrate itself. [0003] Before testing the flip-chip substrate with the testing machine, the flip-chip substrate must be positioned at the position to be tested. However, due to the extremely high contact density on the flip-chip substrate, the spacing between the contacts is extremely small. A slight gap will cause The inspection result is incorrect. The traditional positioning methods, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/304G01R31/28H01L21/66
Inventor 陈金圣陈逸平陈志明
Owner CONTREL TECH CO LTD