IC tag
A label, adhesive layer technology, used in printed matter, instruments, computing, etc.
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example 1
[0107] The release agent layer 7 is formed by covering the trapezoid with two trapezoids and by an outer part of the electronic circuit in a shape as shown in FIG. The area enclosed by the circumference is about 75% of the area enclosed by one outer circumference of the electronic circuit, the distance between the end of the trapezoid and the outside of the substrate sheet 1 is 1 mm in length), silicone resin is applied to polyethylene terephthalate On one surface of the ester film (including a width of 100 mm, a length of 50 mm and a thickness of 50 μm), a certain amount was applied to form a dried thickness of 0.05 μm, and then dried and cured at 130° C. for one minute. Then, a polyester type hot-melt adhesive (manufactured by TOYO BOSEKI CO., LTD., trademark "BAYRON 30SS") was applied to the release agent layer 7 and the surface of the substrate sheet 1 by a gravure coater to a certain extent. The amount is to form a dry thickness of 5 μm to be pressed onto the first adhesi...
example 2
[0118] An IC tag was produced in the same manner as described in Example 1, except that flat protrusions 9 and a release agent layer 7 were formed as shown in FIG. 3 . The shape of the release agent layer 7 contains an angle of 45 degrees, arranged in regular triangles at both ends of the circuit area, the width of the unpressurized part is 3mm, covered with triangles at both ends of the circuit area and covered with diamonds in the electronic circuit area. Area, and the area surrounded by the outer circumference of the electronic circuit 3 and the IC chip 6, is about 70% of the area surrounded by the outer circumference of the electronic circuit, and the interval length between the triangle end and the outside of the substrate sheet 1 is 1mm. The shape and size of the bypass line 8 are the same as those in Example 1. The shape of the planar protrusion 9 is a circle having a diameter of 2 mm and a thickness of 35 mm. The bonding wire 10 has a length of 0.5 mm, a width of 0.1 ...
example 3
[0121] The IC tag was prepared in the same manner as described in Example 1, except that the bypass line 8 was not formed, the planar protrusion 9 directly extended to the circuit line 4, and the planar protrusion 9 and the release agent layer 7 were formed as shown in FIG. 6 . The shape of the release agent layer 7 is a pentagon with an oblique angle of 45 degrees, the width of the unpressurized part is 3mm, and the area covered by two pentagons and surrounded by the outer circumference of the electronic circuit 3 is about 60% of the area enclosed by the outer circumference of the circuit, the length of the interval between the end of the pentagon and the outside of the substrate sheet 1 is 1 mm. The shape of the planar protrusions 9 is a circle each having a diameter of 2 mm and a square having a side length of 2 mm, and a thickness of 35 mm. The bonding wire 10 has a length of 0.5 mm, a width of 0.1 mm, and a thickness of 35 μm. The resulting IC tags are checked by non-con...
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