Light sensitive element packaging material combination and using method thereof

Abstract

The invention provides a kind of radiator for semiconductor component in electric and electron circuit, though the current flowing through the semiconductor is large, it can reduces the radiation of high frequency noise, thus it has excellent heat radiating effect. the device includes the first radiator which is fixed together with the semiconductor and the second radiator which is fixed together with the first radiator, the first radiator and the second radiator are connected to the power supplying circuit of the semiconductor components through the first connecting component and the second connecting component.

Description

technical field [0001] The invention relates to an encapsulating material composition and its application for encapsulating photosensitive elements. Background technique [0002] With the advent of the digital age, photosensitive elements have long been widely used in various electronic products, especially image sensors, which have developed by leaps and bounds in recent years. [0003] The general image sensor packaging method is to first make a frame (dam) around each module circuit with a molding compound on the substrate by transfer molding (transfer molding), and then adhere the image sensor chip with conductivity. The adhesive is fixed in the circuit and wire bonding is completed, and then a layer of adhesive is coated on the frame, and the glass sheet is covered and cured to complete the finished product, such as in the announcements of Taiwan Patent Nos. 459355, 478136, 503574 and 501244 The image sensor packaging structure and packaging method disclosed in the cas...

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Problems solved by technology

[0004] In general manufacturing processes, the light-transmitting layer covering the image sensor chip is mostly glass, such as described in the above-mentioned patent announcement. The reason is that glass has low refractive index, high light transmittance and scratch resistance, but in The packaging process must be packaged in a single package, which consumes a lot of manpower and time, making it difficult to improve the yield rate and high manufacturing costs.

[0005] In addition, in China Taiwan Patent No. 489532, a stack structure of an image sensor is described. The molding method also uses molding compound and transfer molding method, but the light-transmitting layer is molded and covered with a transparent resin layer instead of using glass, however the patent does not teach, reveal or suggest the properties of the transparent resin or its effect on light

[0006] Epoxy resins with a benzene ring structure, such as bisphenol A, bisphenol F, and nathalene, have high refractive index after hardening, although they are transparent. At 1.50, this is because when visible light passes through the benzene ring structure, the unsaturated bond (π bond) on the benzene ring will absorb light energy and cause π-π* interaction to change the refractive index and light transmittance of light

However, if the epoxy resin without benzene ring structure is used instead, although the refractive index can be effectively reduced, other properties such as high glass transition temperature, heat resistance, etc. cannot achieve glass characteristics.

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