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Package member and manufacturing method therefor

A manufacturing method and packaging technology, which are applied in the directions of electrical components, semiconductor devices, circuits, etc., can solve problems such as increasing the manufacturing cost of the packaging 150

Inactive Publication Date: 2009-07-29
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the manufacturing cost of the package 150 is further increased

Method used

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  • Package member and manufacturing method therefor
  • Package member and manufacturing method therefor
  • Package member and manufacturing method therefor

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0046] Please also refer to figure 2 and Figure 3A ~ Figure 3C , figure 2 A flowchart illustrating a method of manufacturing a package according to a first embodiment of the present invention, Figure 3A ~ Figure 3C show figure 2 Schematic flow chart of the fabrication method.

[0047] First, if figure 2 and Figure 3A As shown, in step 301 , a chip 220 is disposed on a substrate 210 . The chip 220 is electrically connected to the substrate 210 by using at least one wire 215 , for example.

[0048] Next, if figure 2 and Figure 3B As shown, in step 303 , an adhesion adjustment layer 230 is formed on the chip 220 . There is a first adhesion between the adhesion adjustment layer 230 and the chip 220 .

[0049] Then, if Figure 3C As shown, the first lens layer 240 is formed on the adhesion adjustment layer 230 to form the package 200 . Wherein, there is a second adhesion between the adhesion adjustment layer 230 and the first lens layer 240 . Since the surface...

no. 2 example

[0057] Please refer to Figure 5 , which shows a schematic diagram of a package according to a second embodiment of the present invention. The package 300 of this embodiment is different from the package 200 of the first embodiment in that a plurality of second lens layers 340 are formed on the first lens layer 240 , and the shape of the second lens layers 340 is further adjusted.

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Abstract

The invention relates to a package element and a relative production, wherein the production comprises that first, arranging a chip on a substrate to be electrically connected, forming an adhesive force adjusting layer on the chip, while the adhesive force adjusting layer and the chip are provided with a first adhesive force between, forming a first lens layer on the adhesive force adjusting layer, while the adhesive force adjusting layer and the first lens layer are provided with a second adhesive force between. The adhesive force adjusting layer can change the surface state of chip, therefore, the interaction between the cohesive force and surface tension of the first lens layer, and the second adhesive force can support the shaping of the first lens layer.

Description

technical field [0001] The present invention relates to a package and its manufacturing method, and in particular to a package with a lens layer and its manufacturing method. Background technique [0002] Please refer to Figure 1A , which shows a schematic diagram of a conventional package. The package 100 includes a reflective cup 101 , a chip 103 and an encapsulant 105 . The chip 103 is placed in the reflective cup 101 . The encapsulant 105 is poured into the reflection cup 101 to cover the chip 103 . [0003] The encapsulant 105 is shaped according to the shape of the reflective cup 101 . After the encapsulant 105 is poured into the reflective cup 101 , the reflective cup 101 will not separate from the encapsulant 105 for repeated use. Therefore, the manufacturing cost of the package 100 is increased. [0004] Please refer to Figure 1B , which is a schematic diagram of another conventional package. Compared to Figure 1A package 100, Figure 1B The package 150 f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 林志维田运宜林睫修刘宇桓陈怡礽王志麟
Owner AU OPTRONICS CORP